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Press Releases

Provides Longer Life for PCB Assemblies, Fewer ‘Bad Vibrations’

MILLEDGEVILLE, GA – Topline, a leading designer, manufacturer, and provider of electronic components and packaging solutions for PCB assemblies, has been granted an exclusive worldwide license by NASA for “Particle Damping for Vibration Mitigation for Circuit Cards.” The NASA invention U.S. Patent Application Serial No. 14/196,203 describes a ‘Vibration Damping Device for Circuit Card Assemblies.’ The invention pertains to the use of PID - Particle Impact Dampers, to attenuate destructive vibrations in PCB assemblies. Usage includes PCB assemblies in all fields. The technology of PID and its benefits will be explained and discussed by TopLine’s President, Martin Hart, in the TopLine booth, #923, at the IPC/APEX EXPO 2017 trade show in San Diego, California February 14-16, 2017.

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Elk Grove Village, Illinois, USA – 20 January 2017 – Pillarhouse USA Inc. today announced With only a few weeks until the IPC APEX 2017 show, Pillarhouse are pleased to confirm that they, once again, will be attending the show.

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Shingle Springs, CA — January 2017 — PDR Americas, a leader in IR Rework, Test and Inspection, is pleased to announce the appointment of MAN-TechSystems as its manufacturers’ representative in Northern California.

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ITASCA, IL — Kester will be exhibiting (booth #2205) at IPC APEX Expo 2017, which will take place February 14-16 at the San Diego Convention Center. Kester’s booth will offer attendees the opportunity to meet with the R&D and sales teams, and learn more about Kester’s new products.

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MADISON, AL — STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, is pleased to announce its 35th year in business.

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GILBERT, AZ and Quebec City, Canada (January 18, 2017) - Finetech, a global supplier of micro-assembly equipment, and the National Optics Institute (INO), Canada's largest center of expertise in optics and photonics, announce the addition of a FINEPLACER® Sigma bonding system at INO's micro-opto-electromechanical systems facility.

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