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Press Releases

Minneapolis, MN - The SMTA and Chip Scale Review are pleased to announce the Workshops for the 14th Annual International Wafer-Level Packaging Conference (IWLPC) held October 26th. IWLPC will be held October 24-26, 2017 at the DoubleTree Airport Hotel in San Jose, California.

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NASHVILLE — August 2017 — KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, has co-authored three papers that will be presented during the technical conference at SMTA International.

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Chester, Connecticut, USA – Ascentech, LLC, a well-known distributor of leading-edge process optimization equipment for electronics manufacturing, has placed two GEN3 Systems’ CM33L+ ionic contamination testers at Amphenol Borisch Technologies (ABT), a vertically integrated Electronics design and manufacturing firm with locations in Grand Rapids (Michigan), Nogales (Mexico) and London (Canada).

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EAST PROVIDENCE, R.I.--(BUSINESS WIRE)--Nordson EFD, a Nordson company (NASDAQ: NDSN) and the world’s leading manufacturer of precision fluid dispensing systems, introduces a new Better Dispensing™ How-To Video series.

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Berlin, 25. August, 2017: Atotech, a world-wide leader in the field of chemicals and equipment for printed circuit board and package substrate manufacturing, will present its latest know-how on Pd initiation in the ENEPIG process at this year’s InterPACK 2017.

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Altoona, Pennsylvania, USA – Amerway Inc., a leading solder manufacturer servicing the electronics industry with high-purity solder products, will be exhibiting a full range of premium solder products including solder bar, wire, fluxes, and custom alloys at SMTAI 2017 in Booth #1134. SMTAI 2017 takes place at the Donald E. Stephens Convention Center in Rosemont, Illinois, Sept. 17-21.

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