News
The plant has 2,400 sq. meters of floor space and will build enhanced cantilever probe cards. It can also handle probe wire diameters from 75 to 250 microns and very fine pitch probing.
The factory will follow K&S' "copy exact" manufacturing model.
Production on after-sales support center for repair and rebuild services in its final stages, the company said.
SINGAPORE, Oct. 14 -- Flextronics said today its takeover of a pair of Nortel Networks' manufacturing plants would be delayed.
The two Canadian facilities are expected to be transfered in February and May 2005, respectively. Previously, Flextronics was to take charge of the plants in November 2004 and February 2005.
The deal is expected to add $2.5 billion of revenues for Flextronics.
In a statement Flextronics' officials said the deal would go through as otherwise planned.
Research Triangle Park, NC, Oct. 13 -- MCNC Research & Development Institute (MCNC-RDI), a North Carolina-based nonprofit research organization, and the North Carolina Agricultural and Technical State University (N.C. A&T) will partner to conduct research related to technological advancements in flexible displays for U.S. Army mobile electronics applications.
The $1.5 million award, spanning three years, establishes the Center of Excellence for Battlefield Capability Enhancements to develop technologies for environmentally stable flexible displays.
N.C. A&T and MCNC-RDI propose to develop a hybrid light-emitting device (HLED) for mobile electronics and vehicle-based communications and weapons systems required by Future Force Warrior (FFW), the U.S. Army's initiative to develop and demonstrate revolutionary support systems for soldiers.
To develop the HLED technology, MCNC-RDI will combine its OLED experience with N.C. A&T's expertise with narrow bandgap semiconductors composed of inorganic materials. MCNC-RDI and N.C. A&T research facilities will be used throughout the project.
Franklin, MA, Oct. 12- Speedline Technologies' series of free monthly technical Webcast seminars exploring the challenges facing engineers in the semiconductor manufacturing
Process will continue this fall. Each seminar, hosted by industry experts, will share "knowledge in process" expertise, how-to insights, and include a Q&A session.
The next session, "Improving Final Product Quality," will take place Oct. 21 at 11 a.m. ET and again at 2 p.m. ET.
The seminar will cover:
o Cost and types of a defect.
o Impact of printing defects on first pass yield.
o Preventing defects.
o Inspection and test process planning.
o 2-D and 3-D solder paste inspection.
Future session includes "Reliable Underfill Dispensing," on Nov. 18 at 11 a.m. and 2 p.m. ET, and "Fine Pitch Printing Process," scheduled for Dec. 16 at 11 a.m. and 2 p.m. ET.
For more information, or to register, visit www.speedlinetech.com/seminars, or call (508) 541-4749.
Cleveland, OH, Oct. 13- Linda Rae, senior VP and general manager of Keithley Instruments Inc., will keynote the 2nd annual EOEM Design Online Expo this afternoon. Her presentation, "Best in Test: How World Class Organizations Rely on Testing To Make Better Products," will take place Oct. 13 from 2:30 to 3:00 p.m. in the Test & Measurement Technology Pavilion.
The presentation will discuss the test philosophies at some of the most successful electronics manufacturers, as well as test strategies to improve manufacturing processes and overall product quality.
The EOEM Design Online Expo is an online conference and exhibition addressing critical technology areas impacting electronic design engineering. Running Oct. 13-14, it covers embedded technology, integrated circuits, packaging & interconnects, passive components, power, and test & measurement. For more information and to register online, visit www.reedbusinessinteractive.com/eoem/index.html.
TAIPEI, Oct. 11 -- Chip-on-board packages could get caught in an upward draft as image sensor modules in camera phones are switched from CSPs.
As much as 50% of camera phone models will be 1.3-megapixel type in 2005, DigiTimes reported today, citing market sources. The models will use COB packaging for CMOS-sensor modules, the Asian-based news service said.
Micron Technology and IC Media began offering COB CMOS sensors earlier this yer, DigiTimes said.
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