The IPC Association (Northbrook, IL) recently commended DEK's (Zurich, Switzerland) technological advances with its new via fill process. Awarded a slot in the Innovative Technology Showcase at the APEX exhibition in Anaheim, CA, DEK's 100% fill technology was described by the judges as groundbreaking.
As part of the new and emerging technologies showcase, the process delivers 100% fill of substrate vias with no voids and minimal surface residue. This Pro-Flow-based process offers solutions to problems such as insufficient fill, voiding, poor throughput and excessive handling of product.
The fully enclosed head is used in conjunction with a dedicated tooling fixture that ensures complete fill of vias in the minimum of print passes (typically two), with a paste pressure of 2.5 bar and a print speed of 25mm/s. In addition, the print material has been shown to have a life of over three months in the transfer head.
Traditional manual or squeegee-based systems are less clean and operator-friendly, and take multiple passes to push material into vias. They can also use a vacuum table to pull material through, resulting in both voids and inadequate deposition.
With results in throughput of over fives times faster than traditional squeegee-based fill processes, the system is repeatable and offers accuracy.
DEK is a global provider of advanced pre-placement manufacturing solutions and innovative deposition technologies for a wide range of electronic materials.
Copyright 2004, UP Media Group. All rights reserved.
In a move to help customers speed time to market and reduce manufacturing costs, Dow Corning Corp. (Midland, MI) has launched the External Equipment Provider Alliance with nine companies from the electronics assembly and packaging industry. Under the new alliance—the first of its kind in this market—Dow Corning will work with member companies and customers to streamline the integration of materials and equipment used in board-level assembly and back-end packaging, resulting in standard equipment or customized solutions that help customers meet production goals more quickly and efficiently.
The network of member companies includes Asymtek (A Nordson Company), Bartec Dispensing Technology, DEK, Fluid Research Corp., Lambda Technologies, Liquid Control Corp., Precision Valve & Automation (PVA), Scheugenpflug AG and Sieghard Schiller GmbH & Co. KG. As providers of meter-mix, conformal coating, fluid delivery, rapid curing, stencil printing and robotic xyz positioning, these companies have all demonstrated expertise in applying and handling Dow Corning's silicone and organic materials.
Under the alliance, Dow Corning will leverage member companies' expertise to simplify the procurement, integration, start-up and optimization of materials and processing equipment. By working together, alliance members can help customers address any number of challenges—from choosing the right combination of equipment and materials for a new process to delivering turnkey production packages. The alliance will also provide a lead contact who will work directly with the customer, coordinating the alliance's resources to develop business solutions.
Tom Cook, Global Industry Executive Director, Electronics & Advanced Technologies Industries, Dow Corning, said, "Dow Corning will partner with customers to provide as little or as much assistance as they need, helping them achieve day-to-day objectives as well as key, long-term business goals. The beauty of an alliance like this is that it gives customers access to more resources than any single supplier could deliver alone."
The company has been organizing the alliance over the past year and has selected members based on its long-term relationships with these and other companies throughout the board-level assembly and back-end packaging industry. Dow Corning plans to expand the alliance to other electronics market segments, such as wafer-level and front-end packaging.
www.dowcorning.com/electronics
Copyright 2004, UP Media Group. All rights reserved.
Photocircuits Corp. (Glen Clove, NY) has announced the realignment of its tooling and manufacturing operations to accommodate rapid growth in its high mix and quick turn business that will increase from $50 million sales in 2002 to an expected $100 million this year. The growth in number of customers to nearly 500, with concomitant increase in part numbers and layers processed, has driven significant changes in the front-end and operational structure of Photocircuits' business.
The company has opened its second offshore tooling center, established to support the increase in tools required by growth in high mix, quick turn business. This newest Tooling group, located in the Philippines, joins the ranks of the groups operating in New York and Costa Rica. All three groups will continue to work under the direction of the Pre-Production Engineering staff in New York and Georgia.
By transferring much of its high-volume backlog to its Peachtree City, GA, operation, the company has made available in Glen Cove substantial manufacturing capacity and the focused technical resources needed to satisfy demands of the high mix, rapid-response marketplace. With the recent installation of new imaging and laser drilling equipment, Photocircuits has increased capacity for conventional and HDI multilayer products.
John Endee, president of Photocircuits Corp., has also announced the promotion of Mike Fuggini to the newly created position of director of operations. Fuggini has been with the company for more than 20 years, most recently responsible for managing the company's process engineering staff and environmental compliance activities.
Fuggini's promotion is an organizational change necessitated by the mushrooming growth in Photocircuits' high mix and quick turn business. He will focus on operational enhancements of the Glen Cove factory producing low volume, quick turn and high technology parts. Fuggini will refine the manufacturing systems to minimize work in progress, continually reduce set-up times and enhance manufacturing capabilities within each process center.
The company has also promoted Steve Graves to the position of national sales director. Graves is a 19-year veteran of Photocircuits' sales organization, most recently managing selling efforts in eastern North America, the Caribbean and Europe.
Copyright 2004, UP Media Group. All rights reserved.
Dynatech Technology Inc. (Horsham, PA), the North American distributor for Samsung surface-mount technology equipment, has signed a distribution agreement with Aegis Industrial Software Corp. (Horsham, PA) to sell and install Aegis's CircuitCAM and CheckPoint software on Samsung equipment.
"It's more than one-stop shopping for our customers," said Mike Foster, director of sales for Dynatech. "With both companies located in the same corporate campus, customers can get their training for the equipment and the software on the same business trip. Customers will benefit from having the training on each system essentially at the same time, making it easier to retain the information and become more productive more quickly when the systems are installed in their plants."
In the market for small to medium electronics manufacturing services (EMS) and original equipment manufacturer (OEM) shops, the Samsung Techwin line includes the newly introduced CP60L compact high-speed chip shooter, CP45F full vision assembly system and a variety of entry-level placement systems, plus machine-control software that can tie into line manufacturing and enterprise information systems. As the North American distributor, Dynatech Technology also provides 24/7 service with a guaranteed 30-minute call-back time.
Manufacturing and process engineers use CircuitCAM to convert CAD design information into visual assembly documentation, reports and optimized machine programs that include the generation and optimization interfaces for the pick-and-place insertion process, inspection and test machines. Users can operate the MS Office suite and programs such as AutoCAD directly within the software environment, and they can transfer documentation into programs such as Word and Excel. Data stored by the software enters a relational database, such as Access, which can be used in stand-alone mode. CheckPoint provides bill-of-materials, revision control and management capabilities.
"This new relationship with our neighbors down the road enables Aegis to further enhance our off-line machine programming capability and better integrate Samsung equipment users into our NPI and MES solutions," said Jason Spera, chief executive officer of Aegis.
Copyright 2004, UP Media Group. All rights reserved.
FCI (Etters, PA), a manufacturer of connectors and interconnect systems, has won a substantial victory in its patent infringement suit involving FCI's ball grid array (BGA) connector technology brought in the U.S. against Hon Hai Precision Industries (Foxconn, Tucheng, Taiwain).
On Feb. 13, after a two-week trial in San Francisco, CA, a jury returned a verdict finding Hon Hai liable for infringement of two FCI patents relating to its BGA connector technology.
The jury also found the infringement to be willful and that Hon Hai is liable for multi-million dollar damages as a result of its infringement of FCI's patents.
The infringing sockets are used in computer notebooks, desktops and servers that use BGA socket technology.
Jean Lucien Lamy, FCI chairman and chief executive officer, said, "We will continue, in this instance and in any other cases that should arise, to pursue all legal means to protect our intellectual property."
BGA patented technology from FCI is currently licensed worldwide to Tyco and Molex for socket applications.
Copyright 2004, UP Media Group. All rights reserved.
Valor Computerized Systems (Yvane, Israel), a provider of productivity increasing engineering software solutions to the electronics design and manufacturing industry, has reached an agreement with Jabil Circuit Inc. (St. Petersburg, FL), a top-tier electronics manufacturing services (EMS) provider. Trilogy 5000 will be implemented at a majority of Jabil's manufacturing and service facilities located in Asia, Europe and the Americas to increase efficiencies in new product introduction (NPI), design for manufacturability (DFM) and assembly process optimization. The deal marks the largest software deployment in Valor's corporate history.
The engineering system selected by Jabil covers the full scope of the assembly engineering solution for an integrated, efficient and productive CAD to DFM to assembly process.
Chris Singleton, global director for manufacturing engineering at Jabil said, "We will be able to accommodate customer ECN's easier and faster as well as provide a higher level of DFM service for customers. Jabil expects Trilogy tools to reduce the engineering process time for new jobs. This is particularly important to our growing high-mix business and will enable us to accelerate new product introductions."
Copyright 2004, UP Media Group. All rights reserved.