News
Sanmina-SCI Corp. (San Jose, CA), an electronics manufacturing services (EMS) company, has reported financial results for its first quarter ended Dec. 27, 2003. The company also announced that it will begin searching for a new chief financial officer.
For the first quarter, Sanmina-SCI reported revenues of $2.97 billion, up 9%, from $2.73 billion in the fourth quarter, and up 17% from the first quarter last year.
The company reported adjusted pro forma net income of $26.2 million, or $0.05 adjusted pro forma diluted earnings per share, compared to $14.0 million, or $0.03 per share in Q4, and $6.8 million, or $0.01 per share, for the same period last year. Cash provided by operations was approximately $110 million for the first quarter.
Sanmina-SCI also reported $1.2 billion in cash and short-term investments. At quarter-end, the company reported a current ratio of 1.9, working capital of $2.1 billion and shareholders' equity of $3.3 billion.
Jure Sola, chairman and chief executive officer of Sanmina-SCI, said, "Clearly we are seeing a positive trend across all of our end-markets, orders have been increasing more steadily, and our customers are talking with a more positive and upbeat tone...This quarter, we made further progress in our original design manufacturer (ODM) strategy, adding two design wins for server products with existing original equipment manufacturer (OEM) customers."
The company also announced that its chief financial officer, Rick R. Ackel, will be leaving the company to pursue other opportunities. Ackel has served as CFO since July 2000. Sanmina-SCI will begin a search for a new CFO and in the interim Sanmina-SCI's controller, Mark Lustig, will serve as acting CFO.
Copyright 2004, UP Media Group. All rights reserved.
Digi-Key Corp (Thief River Falls, MN) has added Murata Electronics (Smyrna, Georgia), a global supplier of ceramic passive components, to its large vendor and product offering.
Mark Larson, president of Digi-Key, said "We are cataloging, and supporting with substantial inventory, nearly 2,000 Murata components including ceramic capacitors, trimmers, resonators, thermistors, filters, inductors and potentiometers."
Digi-Key will offer customers the full line of Murata's products. Digi-Key hopes to enhance Murata's diverse distribution strategy by increasing the manufacturer's position within a variety of markets.
Murata's distribution manager, Darryl Revenew, said, "By adding Digi-Key to our list of channel partners, we can offer greater value to our original equipment manufacturer (OEM) customers. With their focus on the design and engineering communities, customers are able to purchase our products with exceptional turnaround time and superior service."
With close ties to the design and engineering communities, Digi-Key has established a strong client base focused on demand creation and is frequently sought after for sampling and fulfillment needs. Both companies will work closely to provide design enhancements (for existing and future products) to their customer base.
Digi-Key Corp.is a full service provider of electronic components. Its Website offers e online commerce capabilities along with 24/7 instant access to a broad-based, multi-million dollar product inventory. Murata Electronics is one of 47 wholly owned subsidiaries of the world organization Murata Manufacturing Co., Ltd. of Japan. Murata is a patent holder and global manufacturer of ceramic electronic components for the telecommunications, computer/peripheral, automotive, communications and EDP markets.
Copyright 2004, UP Media Group. All rights reserved.
IPC (Northbrook, IL) has announced the collection of free events planned for its co-located IPC SMEMA Council's APEX/IPC Printed Circuits Expo/IPC Designers Summit exhibition and conference, being held Feb. 24-26, 2004, at the Anaheim Convention Center, in Anaheim, CA.
In addition to the complimentary keynote addresses of Solectron president and chief executive officer Michael Cannon, industry forecaster Walt Custer and the multi-talented Bill Nye-The Science Guy, the trade show will feature eight free forums throughout the exhibition and conference. The schedule includes:
1) Beyond Lead Free-WEEE/ROHS on Feb. 24
Chair: Fern Abrams, IPC
This
panel discussion will provide insights into what leading companies are
doing to prepare for the July 2006 lead-free compliance deadlines along
with the latest developments in legislation, exemptions and definitions
of lead free under Waste Electrical and Electronic Equipment (WEEE) and
Restriction on Hazardous Substances (RoHS). Additionally, the panel of
experts will examine the ripple effects of this legislation on laws and
regulations in the U.S. and abroad.
2) North America or Asia: Where is the Best Place for Your Manufacturing? on Feb. 25
Chair: Lisa Hamburg, Circuits Assembly magazine
The
relative complexity, quantity required, circuit density, level of
customization needed and delivery time frame are just a few of the
issues that help determine the supply source. This panel discussion
will discuss and debate the various pros and cons of overseas sources.
3) IPC PCQR2 Database-Globally Accepted de facto Standard for
Comparing Process Capability, Quality and Relative Reliability of PCB
Suppliers on Feb. 24
Chair: David Wolf, CAT, Inc.
The IPC D-36
Subcommittee has developed an industry standard, IPC-9151A, for process
capability test panel designs and the PCQR2 database detailing the
capabilities of printed circuit board (PCB) suppliers. The database
provides quantitative data that allows subscribers to statistically
benchmark board suppliers' capabilities; perform intelligent sourcing;
select new suppliers; ensure design for manufacturability; and
establish realistic design rules. The seminar will include in-depth
discussions on the test panel designs, analysis reports and the
capabilities of the PCB supply chain documented in the database.
4) Domestic PCB Technology Innovations at the U.S. Naval Surface Warfare Center, Crane Division on Feb. 26
Chair: Bill Payne, EG&G Crane Operations
The
Emerging Critical Interconnect Technology (ECIT) program was created to
co-opt military, academic and industrial extension for the purpose of
facilitating North American research and development consistent with
IPC's technology roadmap. This presentation will provide insight into
ongoing ECIT projects, their goals, status, the participants and
potential delivery schedules.
5) NEMI Defective Parts per Million Opportunities (DPMO) Project Forum on Feb. 25
Chairs: Tim Kruse, Plexus NPI Plus, and David Mendez, Solectron Texas LP
The
NEMI DPMO project team is nearing completion of an investigation into
package-level DPMO rates throughout the electronics assembly industry.
Such DPMO data can be used to quantify the expected fault spectrum on a
particular PCB assembly, enabling manufacturers to more accurately
assess the cost of assembly, test, repair and scrap and also estimate
the shipped product quality level of a product. Participants in the
NEMI DPMO Project Team will present findings from the study, share the
lessons learned and discuss the vision for follow-up on DPMO efforts in
the industry.
6) Will the Real Immersion Silver Please Stand Up? on Feb. 24
Chairs: Kim Hyland and Dave Mendez, Solectron
As
consumers demand more cutting-edge electronic devices, as original
equipment manufacturers (OEMs) design higher functioning boards and as
chemical companies make new PCB surface finishes, fabricators and
assemblers need to endure the fast progression of all these changes. In
this session, representatives from fabrication, assembly, OEM and
chemical supply companies will answer all questions and concerns
relating to the implementation of immersion silver.
7) Reactivation of IPC's OEM Council on Feb. 25
Chair: Daryl Sato, Intel Corp.
IPC
is reactivating its OEM Council, which has made significant
contributions to efficiency in the supply chain through development and
release of standardized vendor surveys. The council's mission is to
develop and use a methodology for PCB technology and assessment and
advancement, evaluate PCB supplier process capabilities, identify
technology gaps and monitor R&D advancements and PCB design changes
to ensure gap closure. The panel will discuss their working group
efforts and solicit feedback on ways to integrate and expand such
collaborative projects through the OEM Council.
8) International Technology Interchange-Total Packaging Solution Roadmap on Feb. 24
Chair: Dieter Bergman, IPC
This
forum will discuss global industry needs and how international
organizations are involved in developing common ways of understanding
future development and improving the international supply chain. The
panelists will cover various topics, ranging from the definition of
Jisso to the hierarchy of electronic packaging to optoelectronics and a
global outlook on lead and halogen free.
For more information about these events, visit http://shows.ipc.org or contact Joe Dudeck, IPC communications manager, JoeDudeck@ipc.org.
Copyright 2004, UP Media Group. All rights reserved.
LPKF Laser & Electronics (Wilsonville, OR) has announced the release of the low cost SL740 surface-mount technology stencil laser cutter. The system is designed for low- and medium-volume stencil production, cutting up to 3,000 apertures per hour.
The cutter uses the same proprietary high power infrared laser source compliant with laser safety class 1 as found in LPKF's higher-end models. The entry-level system provides high accuracy and reliability, making it ideal for start-up stencil businesses or a backup system for established shops. It offers a cutting area of 29 x 29 in. and accommodates all common stencils, including stencils for quick release frames. Mounting fixtures are provided for both bare sheets and framed stencils.
"With the introduction of the SL740, we are excited to better address the entry-level market space, while maintaining the signature reliability and accuracy of LPKF's products," said Stephan Schmidt, vice president of LPKF North America.
Copyright 2004, UP Media Group. All rights reserved.
Reptron Electronics Inc. (Tampa, FL), an electronics manufacturing services company, reported that its Second Amended Plan of Reorganization under Chapter 11 of the Bankruptcy Code was confirmed by the U.S. Bankruptcy Court on Jan. 14, 2004. Reptron anticipates the effective date of this confirmation to occur on Jan. 26, 2004, which is about 90 days from the original filing date.
Under the confirmed plan of reorganization, the company's unsecured class of creditors that includes its existing convertible notes will receive new notes with a total principal amount of $30 million. The existing notes, along with all accrued and unpaid interest, will be cancelled. The unsecured class of creditors will also receive 95% of the common shares of the reorganized company. Existing common shareholders will receive the remaining 5% of the common shares of the reorganized company.
"The restructuring of our convertible notes is a key component in our strategic plan, which we believe positions the company to take advantage of future growth opportunities," said Paul J. Plante, Reptron's president and chief operating officer. "Once the restructuring is completed, Reptron will have reduced its debt load by over $70 million over the past 12 months. We are extremely pleased to have completed this restructuring in such a short time frame."
Copyright 2004, UP Media Group. All rights reserved.
IPC (Northbrook, IL) and JEDEC, the Solid State Technology Association, have announced plans to further their efforts in preparing electronics manufacturers for the inevitable European ban on lead by co-sponsoring three international conferences on Lead-Free Electronic Components and Assemblies in the U.S., Europe and Asia in 2004.
Ever since the European Union agreed upon the Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive, in which all affected electrical equipment sold in Europe after July 1, 2006, must be free of lead, IPC and JEDEC have taken an active role in keeping the industry informed of changing requirements and encouraging the voluntary elimination of lead. In their second year of jointly producing domestic and international conferences on lead-free electronics, IPC and JEDEC will host lead-free conferences on March 17-19, 2004, in San Jose, CA; in August 2004 in Singapore and Oct. 20-22, 2004, in Frankfurt, Germany.
Each international conference provides tutorials focusing on subjects such as manufacturing with lead-free, halogen-free and conductive adhesive materials, as well as various workshops that introduce lead-free solders and present selection criteria for lead-free compositions.
The associations will also select industry experts to present a two-day technical conference covering crucial lead-free topics. Presently, conference chairs Jean Hebeisen and David Bergman of IPC and John Kelly and Donna McEntire of JEDEC are seeking papers and presentations in the following areas:
Policy: European lead ban status
Electronics Manufacturing Services (EMS) Industry: On the front line of the change
Component issues (passives and actives)
Design issues
Environmental health and safety effects and alternatives
Printed circuit board (PCB) issues
Original equipment manufacturer (OEM)/Consumer demands/voluntary elimination dates
Recycling options
Substitutions: New commercially available alloys/conductive adhesives/ease of replacement
Cost issues
Reliability evaluations (such as temperature cycling data, tin whiskers)
Roadblocks to implementation
Finishes issues: Organic solder protectants, immersion tin, silver, electroless nickel and palladium
Lead-free and other product sectors
For more information on the conferences or submitting abstracts, visit: www.jedec.org or www.ipc.org.
Copyright 2004, UP Media Group. All rights reserved.
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