Circuits Assembly Online Magazine - Book Reviews

Book Reviews

BOSTON, Dec. 28 -- DEK has shipped company record 75,000 stencils this year, the company said today.

"Over the last 4 years, DEK has made significant investments in our logistics infrastructure, manufacturing capabilities and product R&D," says Michael Brianda, European general manager for DEK process support products. "It is very gratifying to see the fruits of our efforts - the 75,000th stencil shipment of 2004."

DEK manufactures a range of stencils and screens for electronics assembly.

CHINO, CA, Dec. 22 -- Desco Industries will acquire the assets of Static Prevention Inc., a supplier of ESD products. Financial terms were not disclosed.

Under the terms of the agreement, Desco will acquire patents, designs, inventory, tools and equipment and company brand names. Anaheim, CA- based SPI does business under the name SPI Westek.

In a press statement Wayne Hunter, president of Desco, commented that the acquisition of SPI would enhance Desco's range of ESD solutions.

Tom Seratti, president of SPI Westek, will join Desco.

VISTA, CA, Dec. 21 - Fabrinet, a electromechanical manufacturing services company, will add an array of optoelectronic and packaging assembly equipment to beef up its volume assembly of optoelectronic components.

Fabrinet will add equipment for laser diode attachment and thermosonic ball and stitch wire bonding from Palomar Technologies, the companies said today.

The equipment will be installed in Fabrinet's manufacturing facilities in Bangkok.

"Fabrinet is one of a very few EMS companies capable of the precision manufacture in high volume of complex components such as those in the optics, optomechanical, and optoelectronic industries," said Bruce W. Hueners, Palomar vice president of marketing and business development, in a statement.

ROSSLYN, VA, Dec. 22 -- The National Electrical Manufacturers Assn. will sponsor a trade mission to India in February as its members seek to crack the world's second largest population and fastest growing economy.

The mission is aimed at business executives seeking to develop familiarity with the Indian electroindustry supply base and market, acquire firsthand knowledge of emerging business practices and establish contact with key business and government officials.

NEMA is arranging meetings with the U.S. Commerce Department officials, the Indian Ministry of Commerce and Industry and other local officials. The trade group will also attend various engineering conferences and manufacturing sites.

Commitments are due Jan. 10; www.nema.org/media/pr/upload/india-commitment.pdf.

BANGALORE, Dec. 20 - Cookson Electronics Assembly Materials has opened a research center in India, making its the first electronics assembly materials company to do so, the company said today.

The opening of the center on the campus of the Indian Institute of Science in Bangalore brings to four the number of R&D labs Cookson operates worldwide located. The others are in the U.S., the U.K. and Japan.

"Cookson Electronics remain[s] steadfastly committed to serving our customers in the fast growing Asia/Pacific region where we have experienced double-digit growth over the past five years with no slowdown in sight," said David Zerfoss, president of Cookson Electronics Assembly Materials, in a statement.

The new center, a collaboration with the Indian Institute of Science, employs eight doctorates among its staff.