Book Reviews
GALWAY, IRELAND – TE Connectivity has entered into a definitive agreement to acquire Astrodyne TDI, expanding its portfolio of power management and electromagnetic interference (EMI) filter technologies for industrial and mission-critical applications.
TAIPEI, TAIWAN -- Global NAND Flash supply is expected to outpace demand in the second half of 2027, easing the supply constraints that have persisted throughout 2026, according to TrendForce.
EINDHOVEN, THE NETHERLANDS -- Keiron Printing Technologies has raised $24 million to accelerate commercialization of its laser-Induced forward transfer (LiFT) solder paste printing technology for electronics assembly.
PEACHTREE CITY, GA – CIRCUITS ASSEMBLY is accepting entries for its 2026 New Product Introduction Awards for electronics assembly equipment, materials and software suppliers.
MOSCOW, ID -- Schweitzer Engineering Laboratories (SEL) has begun site preparation for a new electronic device manufacturing facility in Moscow, Idaho, representing a $50 million investment that will expand the company's manufacturing capacity.
Press Releases
- Kurtz Ersa Partners with E-tronix for Sales in Illinois and Wisconsin
- XLR8 EMS Welcomes Raul Jorge Lopez Jr. as Director of Program Management and Procurement
- Koh Young America Promotes Ramiro Mora to Lead Service and Applications in Mexico and South America
- ViTrox Americas Welcomes Huy Pham as Technical Support Engineer