Lead-Free Solder Process Development

Edited by Gregory Henshall, Jasbir Bath & Carol A. Handwerker, March 2011

When I started reading this book, I was a little disappointed with the continual references to other technical papers and resources, but at the end of the final chapter, I found much useful and relevant material.  

The book provides an update on lead-free and the current problems facing the industry, with practical solutions. I particularly enjoyed the information on paste technology, with helpful hints on the newer generation of materials.

The first chapter provides a good overview of the current status of legislation, what the issues are, and the future changes that will impact each company. Other chapters cover reflow and wave soldering, rework, area array components, tin whiskers, in-circuit test, and reliability for commercial and high-reliability electronics. The scope of the book provides something for everyone entering lead-free, or those that have been dealing with the technology over the last few years.
The rework chapter focuses on practical issues of extra heat input to product and potential reliability issues. Copper leaching from substrates is covered in some detail. Test engineering issues, often overlooked in other texts, are given practical coverage by two HP engineers.

Content was reviewed by engineers from Flextronics, Jabil, Alcatel, Intel and Lockheed Martin.

Bob Willis will run training workshops at SMTA International, and has 2011 online training webinars on more than 20 design, assembly and soldering process topics at www.bobwillisonline.com/training.asp. He also will return to IPC Apex Expo 2012 in San Diego with more workshops.

Toyota Under Fire

Author: Jeffrey K. Liker, 2011

It has been tough for Toyota, but a recent statement from the US Department of Transportation after a 10-month study said, “Electronics are not to blame” for reported problems.

Toyota has recalled nearly eight million vehicles in the US, so this is some good news. NASA engineering was asked to look at computer control, electronic systems and electromagnetic interference as possible causes for the unintended acceleration issues that captured the headlines around the world. Industry discussion was all about electronics and the possibility of tin whiskers.

This is a very interesting read on the reality and practical way in which lessons were learned, with positive actions taken. There are countless references to different sources of information and reports. It is a long and winding story of well publicized problems experienced by some drivers.

One particularly amazing statistic involved calls to Toyota’s call center after one issue surfaced in the media. The Toyota service department’s 800 numbers went from 3,000 calls per day to a staggering 96,000 calls and stayed at the same level for a week. Reading this section clearly highlights the benefits of keeping call centers in-house, rather than other support operations in different countries.

This is a story that needed to be told and was done effectively.

Bob Willis will run training workshops at SMTA International, and has 2011 online training webinars on more than 20 design, assembly and soldering process topics at www.bobwillisonline.com/training.asp. He also will return to IPC Apex Expo 2012 in San Diego with more workshops.

Profiling Guide for Six Sigma

By Brian O’Leary, 2011

This title has been updated for 2011. The author has provided a practical guide to profiling for reflow soldering. The text also covers profiling of wave soldering systems, with many practical suggestions to improve the process and temperature measurement in general. The supporting video files from the dedicated website are a nice touch, but need more defect material.

O’Leary clearly describes the top ways to get the best out of temperature measurement systems and the real mechanics of thermocouples and tolerances found during measurement. The text focuses on trying to help shop floor staff get the best measurements possible in the shortest time. It provides techniques and tips that help reflow novices improve yields regardless of profiling system used.

The author’s sense of humor and practical experience come across in this easy-to-follow book. The text is relevant to all suppliers.

Bob Willis will run training workshops at SMTA International, and has 2011 online training webinars on more than 20 design, assembly and soldering process topics at www.bobwillisonline.com/training.asp. He also will return to IPC Apex Expo 2012 in San Diego with more workshops.