Characterization results of several Pb-free solder pastes show one capable of low-aspect ratio printing.
Ed.: Part 1 appeared in the January 2017 issue of PCD&F/CIRCUITS ASSEMBLY.
At the beginning of January, PCD&F/CIRCUITS ASSEMBLY asked a number of PCB industry executives to answer a handful of questions about the upcoming year.
Counterfeit avoidance standards need additional detail for addressing and mitigating key risks.
Characterization results of several Pb-free solder pastes show one capable of low-aspect ratio printing.