Achieving zero variation in support infrastructure among larger and smaller contractors.
An innovative new way to collaborate and market internally and externally underscores the selection of the 2015 EMS Company of the Year.
Many nonconductive inks have CTE and TG values that more closely match the board material.
As recently as 2000, filling a via was considered a specialty process limited to a small group of product applications and almost exclusively to one material: conductive ink. Furthermore, this process was dominated by one primary filling material, DuPont CB100. The through-hole vias were filled so that a copper cap could be plated over the via surface to create a solderable land on top of the via, and thus “via-in-pad.”
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Sometimes the customer asks “what?” when what they really want to know is “why?” Not “what is the product” but rather “why should I use it” and “what would I like about it?”
Press Releases
- KIC to Exhibit at Four SMTA Expo & Tech Forums in August
- Genie Electronics Leverages Cetec ERP for Superior Efficiency and Customer Service
- Automatic Nozzle Height Adjustment Reduces the Potential for Soldering Defects in Wave Soldering Processes
- BTU International Appoints E-Tronix as Its Representative in Six States