As a contract manufacturer do you want more results with less effort? The simplest of tools could be the most effective.
As the economy continues to improve more manufacturers are making capital investments to fuel their growth. When business owners and managers consider acquiring equipment, they often think of their payment option as a “lease versus buy” decision.
Changing markets and changing times have brought new management and new vision to the Tier III EMS.
A total of nine groups of PCB surface finish were evaluated for solder spread and voiding performance with assembled BGAs and QFNs.
As printed circuit boards become smaller, the challenges faced when coating them grow. It is increasingly important that products are protected from damage from moisture, dust and other dirt, which can lead to interference and even cause the board to fail.
Using IPC standards, a study identifies and qualifies an aqueous cleaning process capable of removing combinations of no-clean flux residues for high-rel boards.
In this study, a global contract manufacturer received a contract to manufacture Class III devices for a large medical OEM. Since these products are manufactured with no-clean flux, the OEM requested extensive testing, evaluation and validation to confirm that the selected cleaning process is capable of removing all flux residues and thereby ensuring the long-term integrity and reliability required of Class III products.
Press Releases
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- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association