TOKYO — A 7.2 magnitude earthquake rocked Kurihari city, north of Tokyo, on Saturday and led to shutdowns of operations at several electronics makers.
A Fujitsu Ltd. semiconductor factory and certain factories affiliated with Sony were shut down, company officials reported.
FRANKFURT -- May semiconductor sales in Germany were down 19% year-on-year, the Electronics Industry Association (ZVEI) said.
In April and March, sales were down 16% year-on-year, respectively, ZVEI said.
The preliminary book-to-bill ratio in May was 1.01, up from 0.94 in April. The ratio is calculated by the value of orders divided by the value of shipments. A ratio of 1.01 means that for every $100 worth of semiconductors shipped, $101 worth of semiconductors were ordered.
A ratio above 1.0 is considered a sign of expansion.
In April and March, sales were down 16% year-on-year, respectively, ZVEI said.
The preliminary book-to-bill ratio in May was 1.01, up from 0.94 in April. The ratio is calculated by the value of orders divided by the value of shipments. A ratio of 1.01 means that for every $100 worth of semiconductors shipped, $101 worth of semiconductors were ordered.
A ratio above 1.0 is considered a sign of expansion.
KUALA LUMPUR – Unisem and its subsidiary Unisem-Advanpack Technologies have entered into an agreement with FlipChip International to license FCI’s wafer bumping and wafer level packaging technologies.
UAT will license FCI’s core technologies, including Spheron, and FCI will become a shareholder of UAT.
“This new partnership with FCI will enable Unisem to offer additional cutting-edge wafer bumping and wafer level packaging alternatives to our customers,” said S.C. Lau, general manager of UAT. “FCI is providing all necessary documentation, training and engineering support for a fast ramp of its wafer bumping and wafer-level packaging technologies, which will be quickly integrated into our existing full production environment.”
UAT will license FCI’s core technologies, including Spheron, and FCI will become a shareholder of UAT.
“This new partnership with FCI will enable Unisem to offer additional cutting-edge wafer bumping and wafer level packaging alternatives to our customers,” said S.C. Lau, general manager of UAT. “FCI is providing all necessary documentation, training and engineering support for a fast ramp of its wafer bumping and wafer-level packaging technologies, which will be quickly integrated into our existing full production environment.”
MUNICH – A pair of European trade groups will launch a major policy initiative for the electronics and electrical sectors later this month.
ZVEI and Orgalime will present Electra at the Representation of the Free State of Bavaria to the EU on June 25.
ZVEI and Orgalime will present Electra at the Representation of the Free State of Bavaria to the EU on June 25.
WASHINGTON – The AeA today called on the European Union to comply with International Trade Agreement rules covering import duties.
ENDICOTT, NY – Endicott Interconnect Technologies, in concert with Binghamton University and Cornell, has launched the Center for Advanced Microelectronics Manufacturing. The joint project intends to pioneer microelectronics manufacturing research and development in a roll-to-roll format.
These efforts are expected to result in flexible, rugged, lightweight electronic components and innovative products critical in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.
“R&D is our engine for the creation of new products and intellectual property, as well as an important tool for solving today’s manufacturing issues,” said James McNamara, president and CEO of EI. “This collaboration between industry and academia has resulted in a truly impressive CAMM facility that will be the backbone of tomorrow’s electronics and helps to support our long-range technology efforts.”
These efforts are expected to result in flexible, rugged, lightweight electronic components and innovative products critical in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.
“R&D is our engine for the creation of new products and intellectual property, as well as an important tool for solving today’s manufacturing issues,” said James McNamara, president and CEO of EI. “This collaboration between industry and academia has resulted in a truly impressive CAMM facility that will be the backbone of tomorrow’s electronics and helps to support our long-range technology efforts.”
CAMM will also provide large-scale testing whereby academic and industrial research groups can test their work for manufacturing applicability.
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