ST. PETERSBURG, FL -- Jabil Circuit is seeking a new manufacturing facility and company headquarters and its home town is considering nearly $35 million in grants and tax breaks to ensure the EMS firm stays put.
TOKYO – Japanese production of electronics equipment and components slipped in April, falling 4.3% year-over-year, according to preliminary data released by the Ministry of Economy, Trade and Industry.
Consumer and industrial equipment were down 8% and 12%, respectively. Computers were off 8.5%. Telecom was the only major end-product to buck the trend, rising 6.6% year-over-year.
ICs were off 4.1%, while bare boards were down 7.1%.
For the year, equipment and components are down 0.8%.
NORWALK, OH – EPIC Technologies named Bhawnesh Mathur CEO, effective June 23.
Mathur has nearly 30 years’ experience in electronics with such companies as IBM, Arrow Electronics, and Sanmina-SCI.
EPIC’s former CEO, John Sammut, will guide Mathur during the transition and will remain on the board of directors.
Randy Haight, who had acted as interim CEO, will also resume his role on the board.
EPIC is a specialty electronics manufacturer in the high-mix, low-to-medium volume segment of the industry, providing turnkey services from board layout, test development, prototype testing, PCB assembly, and box build to customers in the medical, automotive, telecommunications, and industrial equipment markets.
PHILADELPHIA – The American Competitiveness Institute will sponsor a free electronics adhesives workshop on July 11, in Philadelphia.
The guest speaker is Brian Toleno, Ph.D., director of technical service for Henkel Electronic Materials, who will discuss differences between physical properties of flip-chip and board-level underfill, and how these properties affect underfilled device reliability. In addition, he will discuss different classes, such as cornerbond or edgebond materials and encapsulants, and their effects on reliability.
To register, visit http://www.aciusa.org/workshop or email registrar@aciusa.org by July 9.
The guest speaker is Brian Toleno, Ph.D., director of technical service for Henkel Electronic Materials, who will discuss differences between physical properties of flip-chip and board-level underfill, and how these properties affect underfilled device reliability. In addition, he will discuss different classes, such as cornerbond or edgebond materials and encapsulants, and their effects on reliability.
To register, visit http://www.aciusa.org/workshop or email registrar@aciusa.org by July 9.
EINDHOVEN, THE NETHERLANDS – The Holst Centre has inaugurated its roll-to-roll line for printed electronics.
SAN JOSE – North America-based manufacturers of semiconductor equipment posted $1.03 billion in orders in May, down 5% sequentially, and down 37% year-over-year, SEMI reported.
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