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BLAUBEUREN-SEISSEN, GERMANY Rehm Thermal Systems named Marc Dalderup chief commercial officer soldering systems supplier. He has spent 25 years in the global soldering market, working for Soltec BV, Cobar Soldering Materials and most recently as vice president of sales at Vitronics Soltec.
 
At Rehm he will be responsible for building and management of global sales structures, marketing and account management.
 
General sales manager Henning Obloch will be promoted to VP Sales Europe.
 
REDMOND, WA – Data I/O Corp. has sold selected patents and patent applications to Leannoux Properties for approximately $3.3 million. The company expects to report a net gain of $2.1 million.

The patents and patent applications sold related primarily to technology used in Data I/O ProLINE-RoadRunner product line. As part of the deal, Data I/O retains a nonexclusive, royalty-free license to use the technology.

Additional payments are due to Data I/O upon license or transfer of the proposed patents and patent applications to certain third parties. However, Data I/O said it does not anticipate any payments.

Most of the patents sold relate to technology the company has been practicing for years, and does not include technology related to its most recent development programs.

HANOI – Nepcon Vietnam takes place May 8-10 with an expected 500 exhibitors and 10,000 visitors.

Conference organizer Reed Tradex also produces shows in China, India, Japan, South Korea, Malaysia, Singapore, Thailand, the UK and the US.
MEUNG-SUR-LOIRE, FRANCE -- About 300 workers at Jabil Circuit's facility here are on strike over wage hike demands. 
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WASHINGTON – National Association of Manufacturers president John Engler today called on Congress to consider the US–Colombia Trade Promotion Agreement. In a statement, Engler said, "We dare not let election-year political posturing to compromise our commitment to free trade. The US-Colombia Free Trade Agreement will expand US manufacturing exports, create good jobs and keep our economy growing.
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MUNICH – The top executive of Siemens’s Electronics Assembly Systems today said the business unit welcomes the greater “freedom and opportunities” ahead as it is divested from its longtime corporate parent.

Siemens today officially acknowledged the unit would be transferred into a wholly owned, independent subsidiary by September, the end of the company’s fiscal year.

The move, the company said, could open the door to a joint venture with other electronics companies, a sale or a spinoff.

In a press release, EAS CEO Guenter Lauber said, “An independent EA opens the door to great opportunities for the entire Siplace team. As a business unit of Siemens AG, we had to integrate ourselves into the overall structure, processes and procedures of a large company. The new constellation provides us with more freedom and more opportunities and will enable us to tackle many improvements that had originally been scheduled for the coming years in order to prepare ourselves for the future and the global market.”

 

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