ATLANTA -- UP Media Group Inc. and PCB Design Conference West are seeking abstracts for the PCB West 2007 conference, which will be held March 25 - 30, 2007, at the Santa Clara (CA) Convention Center.
Sponsored by Printed Circuit Design & Manufacture and Circuits Assembly, PCB West annually provides attendees and vendors with the premier conference and exhibition for the design and manufacture of printed circuit boards, high density interconnect and other advanced circuits.
The five-day conference program focuses on PCB design, engineering and manufacturing. The conference is comprised of a three-day Technical Conference (Monday, Wednesday and Thursday) that features lectures, workshops and seminars, plus a Professional Development Certificate Program of one-day and two-day courses. In addition to an exciting two-day exhibition (Tuesday and Wednesday) of top industry vendors, PCB West 2007 will feature a variety of free networking and special events that will be announced at a later date on the show Web site, www.pcbwest.com.
Papers and presentations are sought for the three-day Technical Conference, based on the following course durations: 30-minute paper sessions, one-hour lectures or panel sessions, two-hour workshops, and half-day (3.5 hour) seminars.
Papers and presentations also are sought for a Professional Development Certificate program of in-depth one-day and two-day technical tutorials.
To be considered as a speaker/presenter for PCB West 2007, send an email to Conference Chair Kathy Nargi-Toth, knargitoth@upmediagroup.com, by Oct. 27. Please include: a suggested course title, a suggested course length, a short description of the target audience (“who should attend”), a detailed 100- to 300-word abstract and a bio.
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology rather than on a company’s specific products.
If selected for PCB West 2007, final papers and presentations will be due in early January 2007. Submissions selected for the three-day Technical Conference are published in the conference proceedings and distributed to all conference attendees, exhibitors and speakers. (Submissions selected for the Professional Development Certificate Program are not included in the proceedings.)
Each speaker/presenter will receive a copy of the technical conference proceedings CD-ROM, a complimentary pass for the three-day technical conference, and complimentary admission to the two-day exhibition, keynote address and other special events.
Suggested paper and presentation topics include (but are not limited to):
High speed, high frequency and signal integrity
Component placement
EMI/EMC analysis
Thermal analysis
Lead-free processes (especially how they affect design and fabrication)
RF and microwave design
Packaging design
Mixed-signal design
Area arrays
FPGA design and implementation
Embedded passives and active devices
Flexible circuitry
HDI design and technologies
PCB design/layout basics
Component library creation and management
Design for manufacture, test and assembly
Design (including analog, digital and power supplies)
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Dunn appeared in a Santa Clara, CA, courtroom Thursday afternoon to sign a promise to show for her Nov. 17 arraignment. She made no comments, but may have tipped her defense during an interview with 60 Minutes, to be broadcast Sunday.
ST. LOUIS -- EMS provider LaBarge Inc. landed $15 million in follow-on
orders from Eclipse Aviation Corp. for wiring
harnesses for the Eclipse 500 jet.
The program comes on the tail of $10
million in initial orders under a multiyear agreement with Eclipse announced in April 2006.
TORONTO -- Electronics manufacturing services firm Celestica Inc. has sold its Vimercate, Italy, operations to Bartolini Progetti, to whom Celestica will provide EMS,
after-market, new product introduction and support services on a subcontract
basis. No financial terms were announced.
The plant's 850 employees will be transfered to Bartolini, an Italian logistics and after-market
services provider.
RICHARDSON, TX -- EMS provider TXP Corp. has signed a letter of intent to acquire the assets and intellectual property for Siemens AG's optical network terminal technology, supporting broadband passive optical network and gigabit passive optical network standards. The deal is nonbinding and is subject to customary due diligence. The transaction is expected to close in the fourth quarter.
TAIPEI -- Foxconn Technology will invest a reported $1
billion to build an industrial park in China's Huaian economic
development zone, according to a newspaper report yesterday.
The Hong
Kong Standard cited the Huaian city government as saying that the
company would invest the money in electronics facilities over the
course of five years.
Huaian is located in China's eastern Jiangsu
province.