Pomona, CA– Everett Charles Technologies will consolidate two of its Capital Equipment Group’s wholly owned German business units, atg Test Systems and Luther Maelzer Gmbh. The reorganization is anticipated to be complete by year-end. Till then, both existing operations will continue to service their respective customers. The units manufacture electrical test systems and related products for the bare PCB industry.
Pat Flynn, ECT president and CEO, said in a statement, “This move will leverage the considerable engineering and software talents of each company to the benefit of their respective customer bases and the market in general.”
The consolidated unit will be headed by atg’s managing director, Uwe Rothaug. Hans Higgen, L&M’s managing director, will assume responsibility for the R&D engineering team while atg’s Viktor Romanov will manage the flying probe systems R&D effort.
SIOUX FALLS, SD -- EMS provider Electronic Systems Inc. has been certified to the ISO13485:2003 Medical Device Quality Management Systems Standard by the British Standards Institute (BSI).
"We've worked with our registrar, BSI, for nearly 10 years to assure continued compliance to the ISO 9000 standards so the addition of internal systems to comply with the ISO 13485 has been a straightforward sequence from gap analysis through final implementation," said Jim Subart, quality manager.
"As our company has grown and expanded into the medical device area we have sought to improve and add to our QMS expertise by designing and adding the necessary systems to comply with ISO 13485:2003 as well as ISO 9001:2001", said Gary Larson, president. "The medical device industry continues to be an integral part of our long term growth plan."
Austin, TX -- Increased demand in 2005 resulted in longer delivery times and price increases for laminate flip chip build-up substrates, according to market research firm TechSearch International. While several companies have since added capacity, the situation is expected to remain much the same through the end of this year.
Installed capacity requires time for qualification before substrates can be shipped for production. Approximately 25 weeks are needed to complete incoming engineering evaluation (2 weeks), engineering build (8 weeks) and actual qualification testing (15 weeks).
However, TechSearch notes that the situation should improve in 2007 and 2008 as additional capacity is installed and qualified.
For its analysis, the firm interviewed two dozen laminate substrate suppliers to determine production capacity for build-up FC-PBGA, wire bond PBGA, and laminate CSP substrates.
SAN JOSE – Worldwide revenue of EMS companies reached $190 billion in 2005, up 14% over 2004, according to a report issued today by Electronic Trend Publications.
According to ETP, the EMS industry was responsible for 23% of the total worldwide electronics assembly, valued at
$810 billion. The $190 billion includes all the work done by the
EMS companies for OEM customers, explained spokesman Steve Berry.
SHENZHEN -- Foxconn has admitted to working employees more than twice China's legal limits.
As reported by Circuits Assemblyon June 14, the contract assembler was alleged to have been directing its hourly staff to work as much as 80 extra hours each month.
China labor law permits employees to work no more than 36 hours of overtime per month.
Jersey City, NJ – Cookson Electronics Assembly Materials had 23 applications engineers trained and certified as IPC Specialists in May.
“At Cookson Electronics, we are focused on helping our customers meet their electronic assembly objectives by providing them with innovative assembly products and the highest possible level of technical assistance,” said Steve Brown, director – Global Applications Technology. “We train and certify our field applications engineers to the IPC Standards which are used globally by our customers. This is especially important as they transition to lead-free processes in response to the RoHS requirements.
The standards covered during the training session were IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610D Acceptability of Electronic Assemblies.