ATLANTA -- In his blog today, Dr. Brian Toleno of Henkel reminds users to profile adhesives and underfills as they would solder pastes.
Click here to read: http://circuitsassembly.com/blog/?p=16
Click here to read: http://circuitsassembly.com/blog/?p=16
Westford, MA and Munich, Germany – Zuken and Lockheed Martin have signed a long-term contract for PCB design/ECAD (electronic computer aided design) tools. Zuken was also recently selected as the Preferred Supplier for ECAD by the PCB Design Solutions Engineering Process Improvement (EPI) Program's Electrical Subcouncil, which represents all of Lockheed Martin's businesses.
Zuken's scalable enterprise-wide PCB design solution, CR-5000, is at the core of the contract, along with Signal Integrity design tool suite, CR-5000 Lightning.
BRUSSELS – Valor Computerized Systems has implemented its DFM software at Siemens Bocholt in Germany, the company said today.
In a press release, Siemens said it chose the Valor tool for its extensive DfM analysis and checking capabilities. “We also wanted to improve data management and bidirectional communication with our bare board manufacturer.” The tool has cut setup time and costs and improved handling of manufacturing change orders.
Valor’s DFM software is based on Enterprise 3000 and simulates production from design through manufacture to assembly. Designs are optimized using a physical design model of the PCB assembly to reduce revision spins.
MINNEAPOLIS -- The SMTA and Auburn University seek abstracts for the Harsh Environment Electronics Workshop
a two-day program that will focus on assemblies, semiconductor technology, substrates, connectors and lead-free products for use in automotive, space, military and avionics.
Abstracts of 200-300 words should focus on the latest developments, state-of-the-art technology and trends. The deadline is March 22.
The event will be held July 19-20 in Indianapolis.
Contact: conference coordinator Melissa Serres at melissa@smta.org.
Abstracts of 200-300 words should focus on the latest developments, state-of-the-art technology and trends. The deadline is March 22.
The event will be held July 19-20 in Indianapolis.
Contact: conference coordinator Melissa Serres at melissa@smta.org.
UTICA, NY -- Indium Corp. vice president of technology Dr. Ning-Cheng Lee will emphasize reliability in a presentation to be delivered at the Intel Lead-Free Symposium in Scottsdale, AZ, next week.
Dr. Lee’s presentation will depict a supplier’s perspective on the impact and challenges for next-generation flux and paste in drop-critical applications.
Dr. Lee will look at flux and paste formulation directions, expected challenges, assembly implications and challenges, and the shift to using Pb-free fluxes.
Dr. Lee is a renowned expert on soldering and frequent lecturer.
The symposium takes place March 15-16.
Dr. Lee’s presentation will depict a supplier’s perspective on the impact and challenges for next-generation flux and paste in drop-critical applications.
Dr. Lee will look at flux and paste formulation directions, expected challenges, assembly implications and challenges, and the shift to using Pb-free fluxes.
Dr. Lee is a renowned expert on soldering and frequent lecturer.
The symposium takes place March 15-16.
YAVNE, ISRAEL – Valor Computerized Systems announced full support and integration of its Trilogy 5000 assembly line automation software with the SIPlace Pro interface used in Siemens' placement systems.
The integration is important because Siemens has close to a 30% market share worldwide in the component placement market.
The integration enables users to optimize their assembly lines, Valor said.
In a statement, Valor executive vice president for marketing and product management Julian Coates said, “The seamless integration between Valor’s Trilogy 5000 advanced assembly line engineering solution and the powerful SIPlace Pro open interface delivers tremendous cost savings to Siemens customers by generating the fastest route from data load to optimized machine program generation. Siemens customers will enjoy reduced NPI cycle time, increased shop floor productivity, and quicker machine programming and set-up times.”
The Valor tool improves CAD/BoM loading, stencil optimization, rotation neutralization, first-rate machine/line optimization and balancing and NPI debug time, among other features, Valor said.
The integration is important because Siemens has close to a 30% market share worldwide in the component placement market.
The integration enables users to optimize their assembly lines, Valor said.
In a statement, Valor executive vice president for marketing and product management Julian Coates said, “The seamless integration between Valor’s Trilogy 5000 advanced assembly line engineering solution and the powerful SIPlace Pro open interface delivers tremendous cost savings to Siemens customers by generating the fastest route from data load to optimized machine program generation. Siemens customers will enjoy reduced NPI cycle time, increased shop floor productivity, and quicker machine programming and set-up times.”
The Valor tool improves CAD/BoM loading, stencil optimization, rotation neutralization, first-rate machine/line optimization and balancing and NPI debug time, among other features, Valor said.
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri