ATLANTA -- Visiprise Inc. and HMS Software Inc.
will merge operations, forming
a manufacturing software environment provider with more than 270 employees and more than
200 customers.
The merged company will retain the Visiprise name and will be run by Visiprise CEO Sean McCloskey.
The transaction is scheduled to close in November and includes $32 million of new financing led by Investor Growth Capital and Westbury Partners.
McCloskey said, “Visiprise’s roots stem from the high-volume electronics industry. Manufacturers will be using our solutions to build everything from thousands of circuit boards to complex jet engines. In addition, the revenue and customer scale enhances our partnerships with SAP and UGS.”
HMS Software president and cofounder Alex Houtzeel will join the Visiprise board of directors, and with Rob McNiff will jointly run the aerospace and defense business unit.
The merged company will retain the Visiprise name and will be run by Visiprise CEO Sean McCloskey.
The transaction is scheduled to close in November and includes $32 million of new financing led by Investor Growth Capital and Westbury Partners.
McCloskey said, “Visiprise’s roots stem from the high-volume electronics industry. Manufacturers will be using our solutions to build everything from thousands of circuit boards to complex jet engines. In addition, the revenue and customer scale enhances our partnerships with SAP and UGS.”
HMS Software president and cofounder Alex Houtzeel will join the Visiprise board of directors, and with Rob McNiff will jointly run the aerospace and defense business unit.
SEOUL -- Samsung Electronics reported third-quarter net income of 1.88 trillion
won on 14.54 trillion won in sales, spurred by semiconductors, LCDs and mobile phones. The company sold a record
26.8 million phones in the third quarter.
Year-on-year, overall sales were up 1.4%. Operating profits fell 22.5%, however.
Sequentially, operating income was 2.13 trillion won, up 28.8%, net profit rose 11%, and sales jumped 7%. Operating profit surged 29% in the third quarter on the back of increased sales of NAND flash chips, strong demand for LCDs and increased sales of mobile phones in Europe and North America.
The growth rate of net profit in the third-quarter was less than that of operating profit due to provisions set aside to cover costs related to the U.S-government investigation into the price-fixing of memory chips.
Semiconductor sales and net income increased to 4.59 trillion won and 1.35 trillion won, respectively, as demand for NAND Flash chips used in MP3 players and mobile phones remained robust. Migration to the finer process technology in both DRAM and NAND Flash helped reduce manufacturing costs and boost profitability.
Samsung produces DRAM chips on 80nm and 90nm processes, and the company finished developing a 512Mbit DDR2 memory device on a 70nm process. Yields per wafer will be 100% higher than using 90nm technology.
Telecommunication Network posted sales of 4.58 trillion won, and operating income of 550 billion won. Globally, the handset market is increasingly becoming more competitive as companies produce more mid-to-low-end handsets. Demand for Blue-Black phones, launched in November 2004, remained robust in the quarter. The company expects stronger ASPs in the fourth quarter with the launch of new premium products such as D600 and 3G phones.
LCD reported revenue and operating income figures of 2.68 trillion won and 300 billion won, respectively. The company expects its performance to improve in the fourth quarter as demand for LCDs increases, especially the sales of 32" and larger LCD TV panels.
Digital Media sales decreased to 1.64 trillion won and posted a 20 billion won operating loss. Sales in its Digital Appliance Business dropped 15% to 850 billion won and operating income at 40 billion won.
Samsung anticipates positive fourth-quarter results as demand for IT products tend to surge in the year end.
Year-on-year, overall sales were up 1.4%. Operating profits fell 22.5%, however.
Sequentially, operating income was 2.13 trillion won, up 28.8%, net profit rose 11%, and sales jumped 7%. Operating profit surged 29% in the third quarter on the back of increased sales of NAND flash chips, strong demand for LCDs and increased sales of mobile phones in Europe and North America.
The growth rate of net profit in the third-quarter was less than that of operating profit due to provisions set aside to cover costs related to the U.S-government investigation into the price-fixing of memory chips.
Semiconductor sales and net income increased to 4.59 trillion won and 1.35 trillion won, respectively, as demand for NAND Flash chips used in MP3 players and mobile phones remained robust. Migration to the finer process technology in both DRAM and NAND Flash helped reduce manufacturing costs and boost profitability.
Samsung produces DRAM chips on 80nm and 90nm processes, and the company finished developing a 512Mbit DDR2 memory device on a 70nm process. Yields per wafer will be 100% higher than using 90nm technology.
Telecommunication Network posted sales of 4.58 trillion won, and operating income of 550 billion won. Globally, the handset market is increasingly becoming more competitive as companies produce more mid-to-low-end handsets. Demand for Blue-Black phones, launched in November 2004, remained robust in the quarter. The company expects stronger ASPs in the fourth quarter with the launch of new premium products such as D600 and 3G phones.
LCD reported revenue and operating income figures of 2.68 trillion won and 300 billion won, respectively. The company expects its performance to improve in the fourth quarter as demand for LCDs increases, especially the sales of 32" and larger LCD TV panels.
Digital Media sales decreased to 1.64 trillion won and posted a 20 billion won operating loss. Sales in its Digital Appliance Business dropped 15% to 850 billion won and operating income at 40 billion won.
Samsung anticipates positive fourth-quarter results as demand for IT products tend to surge in the year end.
MILPITAS, CA -- Solectron
Corp. today named Dr. Linda Capuano senior vice president
of design and engineering, a new position, responsible for services and collaborative
engineering.
WASHINGTON -- With Congressional action
to mark up DTV legislation approaching rapidly, 31 CEOs and corporate
presidents of leading U.S. high-tech companies are calling on the House
and Senate Commerce Committees to enact a "hard date" now for the
successful conclusion of the transition from analog to digital
television.
Among those who signed the letter are Alcatel North America President and CEO Hubert de Pesquidoux, Aloha Partners President and CEO Charles Townsend, AT&T Chairman and CEO David Dorman, Cisco Systems President and CEO John Chambers, Dell President and CEO Kevin Rollins, Intel Corporation Chairman Craig R. Barrett, Microsoft Chairman Bill Gates, QUALCOMM CEO Paul E. Jacobs, Texas Instruments President and CEO Richard K. Templeton, and T-Mobile USA President and CEO Robert Dotson.
Among those who signed the letter are Alcatel North America President and CEO Hubert de Pesquidoux, Aloha Partners President and CEO Charles Townsend, AT&T Chairman and CEO David Dorman, Cisco Systems President and CEO John Chambers, Dell President and CEO Kevin Rollins, Intel Corporation Chairman Craig R. Barrett, Microsoft Chairman Bill Gates, QUALCOMM CEO Paul E. Jacobs, Texas Instruments President and CEO Richard K. Templeton, and T-Mobile USA President and CEO Robert Dotson.
GLEN COVE, NY -- Photocircuits Corp., once the largest
independent manufacturer of
printed circuit boards in North America, has filed for Chapter 11
bankruptcy. The filing involves only the company’s U.S. operations
and does not affect its Costa Rica or Philippine operations.
The company is seeking a new long-term equity investor.
FRANKLIN, MA – Speedline Technologies has been granted a patent for an analysis technique
used to quantify the amount and geometry of solder paste between printed deposits.
US Patent 6,891,967 describes a technique that uses the texture of solder paste to identify its position relative to the pad and soldermask.
US Patent 6,891,967 describes a technique that uses the texture of solder paste to identify its position relative to the pad and soldermask.
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri