The results met company expectations.
In a press statement, Jeffrey T. Gill, president and chief executive, said, "Revenue continued to climb while the costs associated with the increase in manufacturing capacity, launch of new programs and disruption of material deliveries began to abate from the levels experienced during the fourth quarter. We expect these cost overruns to continue during the second quarter at a declining rate as the new manufacturing cells are completed and new programs enter full production, after which we expect margins to gradually return to historical levels."
For the quarter, backlogs rose 22% to a record $261.7 million. it was the ninth consecutive quarter of
year-on-year growth in bookings.
Sales of electronics declined to $35.6 million, compared to $40.9 million for the prior year and were down 23% sequentially from the fourth quarter. The compay said the drop was normal and cited seasonality in government's procurement cycles. Gross profit for the quarter was $5 million, down from $7.9 million, due to continued decline in shipments for data systems products.
Cary T. Fu, president and chief executive, called the results "excellent in
light of the soft economic conditions seen recently in the technology
marketplace."
For the quarter, operating margin was 4.4%, and return on invested capital was 13.8%.
As of March 31 Benchmark had cash and short-term investments of $344 million and no outstanding debt.
Inventories increased by $39 million to $295 million; inventory turns were 6.4 times.
Benchmark guided for second quarter revenue of $525 million to $550 million.
Bannockburn, IL - As the electronics industry races to meet the EU's RoHS Directive, IPC and Soldertec Global --a division of Tin Technology-- are sponsoring the third International Conference on Lead-Free Electronics on June 7-10 in Barcelona.
Critical lead-free issues include new alloys and materials evaluations, inspection changes, tin whiskers, lead-free on advanced packages like chip scale and flip chip, and reliability. Assembly operations will face increased assembly costs (perhaps 15% higher) and will impact areas beyond manufacturing such as field support, sales, marketing and training.Conference topics and educational courses will cover:
Policy development: European/Asian/other legislation or voluntary activity on hazardous materials and recycling; Legislative compliance and policy enforcement methods;
Supply chain issues: Standards for marking and test; Materials declarations, part number, obsolescence, etc.;
Production issues: Design for lead free production; Component solder, board development, availability and lead-free compatibility; Examples of implementation; Reflow, wave, hand soldering, inspection, repair, rework and test;Cost issues: Tin whiskers; Reliability test data and method developments; High reliability product sectors (automotive, aerospace, etc.)
Environmental considerations: Toxicity and risk; Recycling; Substitutes for other hazardous substances.
HERNDON, VA -- A new standard for simplifying materials declaration being jointly developed by several leading trade groups will be circulated for industry review in June.
In a joint statement, IPC, iNEMI and RosettaNet said the draft of IPC-1752 will be released for a 60-day industry review on June 1.
The standard will integrate existing efforts, including recommendations from a pair of iNEMI projects plus RosettaNet's e-business process standards for material composition.