Richardson, TX -- It's solder bumping, not jetting or gold stud bumping. CVI (www.covinc.com) can now bump single die and partial wafers with solder alloys that are representative of final production. Available alloys include SnPb (eutectic), SAC, Pb-rich, InPb and AuSn.
Bumping helps in high-speed, high-power applications that need quick turn to validate design, and helps provide better test simulation prior to final design. When cycle time is important, cost is critical and resources are limited, bumping a few die at a time can be effective to evaluate a design. The process is applicable to traditional or MEMS components, and bumps can be applied to a substrate or die. Bump-to-bump variability is reportedly reduced compared to other processes such as solder jetting, screen-printing or electroplating. The traditional prototype method of using gold studs followed by thermocompression or thermosonic bonding can be eliminated. The company can also attach solder balls to bare Al bond pads. The same hardware can be used to bump a die with various alloys to evaluate lead-free solutions. Alternating pads on the die can be bumped with differing alloys or geometry, allowing electromigration studies within the same die or within one wafer. This also reduces lot-to-lot and wafer-to-wafer variation.
The process is said to eliminate variables such as paste viscosity, metal load changes, missing bumps, voiding, and changes in size and planarity.
CVI can accommodate individual die bumping, partial wafer bumping, or die repair with various alloy compositions. Contact Terence Collier for more information: tqcollier@covinc.com.
HOUSTON, TX, March 17 - Action Circuits (UK) Ltd. recently purchased a BP4700 automated system from BP Microsystems. The company added to its full range of BP Micro programming systems to accommodate its increasing programming service.
Action Circuits services large component distributors, key names in the automotive industry and is the only approved programming center for Quicklogic Corp., Xilinx Inc. and Altera Corp. in Europe. The Luton, England-based company expects to program over 12 million devices this year.
NASHUA, NH -- Teradyne Inc.'s printed circuit board plant today received a key U.S. EPA recognition for surpassing environmental regulation standards.
The company's High Performance Circuits facility was named a member of the EPA's National Environmental Performance Track program, joining more than 300 facilities nationwide in their commitment to consistently exceed environmental regulation requirements. Teradyne is among only six companies in New Hampshire to be selected, the company said.
The National Environmental Performance Track program is designed to recognize and encourage top environmental performers -- those that go beyond compliance with regulatory requirements to attain levels
of environmental performance and management that benefit people,
communities and the environment, the company said in a statement.
The Teradyne plant qualified for the program through its performance, continuous commitment to environmental compliance and implementation of a strong environmental management system.
"Performance Track facilities represent a new generation of environmental leaders who have the vision to embrace the strategies that will protect the environment for generations to come," said Dan Fiorino, director of EPA's Performance Incentives Division.
COLLEGE PARK, MD - DfR
Solutions and Interface Sciences Corp. have begun a joint investigation
into potential improvements in CAF resistance through the application of ISC's
molecular assembly and deposition technologies.
DfR
Solutions, which has extensive experience in CAF experimentation and failure
analysis, has identified this technology as a critical link in ensuring CAF
robustness in high-density printed boards subjected to Pb-free reflow. The ISC
process increases the uniformity and surface density of silane coupling agents
on glass reinforcement - up to four times denser - compared with current
technology, the companies said in a joint statement. This is expected to
improve the intrinsic resistance of the fiber/epoxy bond to hydrolysis and
cracking (during drilling), decreasing the influence of manufacturing defects
on CAF. In addition, the process enables the deposition of novel surface
chemistries that are expected to suppress filament formation. Substantial
increases in CAF resistance are expected from the combination of these effects.
DFR and
Interface are currently establishing supply chain development channels with
glass, laminate and PCB manufacturing companies.
NEW ALBANY, IN - Key Electronics
Inc., a provider of electronics manufacturing services, has acquired the
assets of Accutronix Manufacturing Services. Financial details were not disclosed.
Accutronix is a privately-held
electronics manufacturer with 47 employees in Owingsville, KY.
Mark
Fulks, senior vice president at Key, becomes general manager for the Kentucky operation.
Key employs about 100 workers at its New Albany factory, and is constructing a 104,000
sq. ft. office and manufacturing facility in Jeffersonville, IN. The new plant is scheduled to be opened this summer.
TORONTO -- EMS provider SMTC Corp. today
reported fiscal 2004 net earnings of $1.3 million on revenue of $245
million. This compares with a net loss of $40 million on revenue of
$306 million last year.
The fourth-quarter net loss narrowed but sales declined sharply. Revenue and earnings were hurt by an
unanticipated volume decline from a major customer that operates in a cyclical
sector, the company said.
For the year the company generated $5.1
million in cash from operations. down from $5.5 million for 2003.
In a press release, John Caldwell, president and chief executive, said,
"We expect to produce sequential revenue growth by the second quarter
of 2005 and continue with positive momentum through the back half of
the
year."
For the fourth quarter the company reported a net loss of
$2.5 million on sales of $48 million. SMTC took $700,000 in restructuring
and other one-time charges. SMTC lost $2.6 million on revenue of $76.9 million a year ago.