The
RO06plus oven from ESSEMTEC (Glassboro, NJ) offers the new possibility
to run test cycles with a duration of up to 18 hours. This function is
mainly used in the area of
component or material testing, for special curing applications or for
burn-in in temperature ranges up to 300° C.
The
oven also offers the possiblity to solder printed circuit boards (PCBs)
with standard or lead-free pastes. The integrated full convection
chamber ensures low delta-t values and narrow process windows. The
compact design allows oven use even in narrow locations like
development or testing laboratories.
The
motorized drawer moves the parts or PCBs automatically into the heating
chamber as soon as the programmed base temperature is reached. After
finishing the temperature cylces, the automatic drawer system moves the
pieces out into an integrated cooling zone.
An additional N2 connection with integrated flow meter allows oven operation with an inert atmosphere.
Software
records temperature profiles of the parts/PCBs, as well as the oven
temperature itself, in real time. Protocols from the software can be
saved, printed and compared with original profiles.
Copyright 2004, UP Media Group. All rights reserved.
Viscom, Inc. (Norcross, GA) recently announced the addition of Frank Marangell as the company's new vice president of sales. In this role Frank will manage the business in the Americas.
Marangell brings 14 years of experience in the automated optical inspection (AOI) business, and he has an engineering degree and MBA.
Currently living in Boston, MA, Marangell will be relocating to the company's U.S. headquarters in Atlanta, GA.
Agilent Technologies Inc. (Palo Alto, CA) and Digi-Key Corp. (Thief River Falls, MN), an electronic component distributor, recently announced that they have signed a distribution agreement. The agreement allows Agilent's Semiconductor Products Group (SPG) to make an array of its products accessible to designers via Digi-Key's distribution channel and real-time online service and support site.
Digi-Key's inventory of Agilent products includes a full range of LEDs and displays, optocouplers, motion control encoders, radio frequency (RF) and microwave devices and infrared and optical transceivers. These products are used in applications that span industrial, office automation, consumer electronics, home appliances, signs and signals, wireless, networking and automotive markets.
"The addition of Digi-Key to our global distribution network will help us reach more engineers in the critical early stages of their designs," said Frank Robertazzi, vice president of worldwide distribution for Agilent's SPG. "Digi-Key's catalog distribution channel provides another avenue for our customers to purchase samples and order literature and early production quantities online at any time."
Kester (Des Plaines, IL) recently announced that chief technology officer Dennis Bernier was honored by IPC—Association Connecting Electronics (Northbrook, IL) with a Distinguished Committee Service Award. The award was presented at the IPC APEX/Expo held in late February in Anaheim, CA.
Bernier was honored as one of 12 members for their leadership and significant contributions in the development of IPC J-STD-004A, Requirement for Soldering Fluxes.
This award is given to IPC committee members who have made an exceptional contribution to a specific standard, guideline, round robin test program or other IPC program.
API Electronics Group, Inc. (Hauppauge, NY) announced recently that it has purchased all of the assets of Islip Transformer & Metal Co. Inc. (Westbury, NY), a private company that supplies critical systems and components to the U.S Department of Defense (DoD). The acquisition will strengthen API's position in the defense sector, bringing additional engineering expertise and complementary product lines to the business.
Under the terms of the all cash deal, API purchased Islip's contracts, workforce, test/production equipment, product rights and trade name. Islip has current contracts totaling $882,955 and projected revenues in excess of US$1.5 million for the 2004 calendar year.
"The acquisition of the business of Islip Transformer & Metal enables API to further augment its in-demand catalogue of components and systems for both government and corporate clients," said Tom Mills, president & COO for API Electronics. "The Islip business will be integrated into our API Electronics Inc. subsidiary, and we expect to have operations moved into our technology and manufacturing center in Hauppauge, NY, by the end of April. Revenues generated from the Islip acquisition through May 31st will be reflected in API's fiscal 2004 financials, and we expect this deal to have a positive impact on our results. We further expect that Islip will bring API increased revenue on a long-term basis."
In business for over 50 years, Islip supplies the U.S. government with a wide range of electronic components and systems. Among its contracts with the DoD, Islip has supplied various types of build-to-print electronic modules, multilayer printed circuit board assemblies, flexible cables, I/O boards, radio frequency (RF) and connection cables with multiple wire strands and RF modules, and chassis assemblies. Islip components have been utilized in a variety of defense systems, including military generators, night scopes and missile systems.
Islip also manufactures and supplies the exciter component that works in conjunction with the Deck Status Light System manufactured by API's subsidiary TM Systems. This system provides helicopter pilots and flight deck crew with information about the status of landing areas.
In addition to manufacturing its own line of electronic components and systems, Islip has worked in all phases of contract manufacturing—from supplier chain control, incoming inspection and production to final assembly and testing. Contract services provided by the company include custom design, material procurement, electronic circuit board assembly, electromechanical assemblies, cable harness assemblies, and electrical and environmental testing.
While consumption of integrated circuits (ICs) in China should be very healthy between 2002-2005, it will be a mixed blessing for equipment manufacturers, according to the report, Mainland China's Semiconductor and Equipment Markets: A Complete Analysis of the Technical, Economic, and Political Issues, recently published by The Information Network (New Tripoli, PA).
China's IC industry is expanding rapidly. In 2003, the country produced 12.4 billion chips, which accounted for just 20% of domestic demand. Most high-end products used in computers and mobile phones had to be imported. Domestic semiconductor companies also had to import designs from overseas companies. Unit production will nearly double to 22 billion units in 2005, but domestic production will grow to meet only 22% of domestic demand.
"The equipment market in China is not what it's cracked out to be," stated Dr. Robert Castellano, president of The Information Network. "IC production is limited to 0.18 microns on 200 mm wafers. Much of the production equipment used in fab expansion are tools transferred from older lines from Japanese and eventually Taiwanese IC manufacturers. Non-Chinese IC manufacturers will buy state-of-the-art 90 nm tools for 300 mm production for their existing facilities and transfer outdated tools to China. In addition, the used equipment market will be huge. Second- and third-tier new equipment vendors will also benefit, as top-tier players have focused on the latest technology."
In 2003, the front-end equipment market saw 18% growth to $1.25 billion on the strength of sales to SMIC, according to the report.
"The Chinese government is investing $10 billion in the semiconductor industry in the next two years to increase production," added Dr. Castellano. "That effort, among others, will encourage additional construction of 300 mm fabs by SMIC and others, resulting in a front-end semiconductor equipment market of $4.2 billion in 2005."
The 340-page report analyzes Mainland China's semiconductor and equipment industries, examining the technical, economic and political issues that are shaping the industry. Markets are forecast from 2001 to 2006.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association