Dynatech Technology Inc. (Horsham, PA), the North American distributor for Samsung surface-mount technology equipment, has signed a distribution agreement with Aegis Industrial Software Corp. (Horsham, PA) to sell and install Aegis's CircuitCAM and CheckPoint software on Samsung equipment.
"It's more than one-stop shopping for our customers," said Mike Foster, director of sales for Dynatech. "With both companies located in the same corporate campus, customers can get their training for the equipment and the software on the same business trip. Customers will benefit from having the training on each system essentially at the same time, making it easier to retain the information and become more productive more quickly when the systems are installed in their plants."
In the market for small to medium electronics manufacturing services (EMS) and original equipment manufacturer (OEM) shops, the Samsung Techwin line includes the newly introduced CP60L compact high-speed chip shooter, CP45F full vision assembly system and a variety of entry-level placement systems, plus machine-control software that can tie into line manufacturing and enterprise information systems. As the North American distributor, Dynatech Technology also provides 24/7 service with a guaranteed 30-minute call-back time.
Manufacturing and process engineers use CircuitCAM to convert CAD design information into visual assembly documentation, reports and optimized machine programs that include the generation and optimization interfaces for the pick-and-place insertion process, inspection and test machines. Users can operate the MS Office suite and programs such as AutoCAD directly within the software environment, and they can transfer documentation into programs such as Word and Excel. Data stored by the software enters a relational database, such as Access, which can be used in stand-alone mode. CheckPoint provides bill-of-materials, revision control and management capabilities.
"This new relationship with our neighbors down the road enables Aegis to further enhance our off-line machine programming capability and better integrate Samsung equipment users into our NPI and MES solutions," said Jason Spera, chief executive officer of Aegis.
Copyright 2004, UP Media Group. All rights reserved.
FCI (Etters, PA), a manufacturer of connectors and interconnect systems, has won a substantial victory in its patent infringement suit involving FCI's ball grid array (BGA) connector technology brought in the U.S. against Hon Hai Precision Industries (Foxconn, Tucheng, Taiwain).
On Feb. 13, after a two-week trial in San Francisco, CA, a jury returned a verdict finding Hon Hai liable for infringement of two FCI patents relating to its BGA connector technology.
The jury also found the infringement to be willful and that Hon Hai is liable for multi-million dollar damages as a result of its infringement of FCI's patents.
The infringing sockets are used in computer notebooks, desktops and servers that use BGA socket technology.
Jean Lucien Lamy, FCI chairman and chief executive officer, said, "We will continue, in this instance and in any other cases that should arise, to pursue all legal means to protect our intellectual property."
BGA patented technology from FCI is currently licensed worldwide to Tyco and Molex for socket applications.
Copyright 2004, UP Media Group. All rights reserved.
Valor Computerized Systems (Yvane, Israel), a provider of productivity increasing engineering software solutions to the electronics design and manufacturing industry, has reached an agreement with Jabil Circuit Inc. (St. Petersburg, FL), a top-tier electronics manufacturing services (EMS) provider. Trilogy 5000 will be implemented at a majority of Jabil's manufacturing and service facilities located in Asia, Europe and the Americas to increase efficiencies in new product introduction (NPI), design for manufacturability (DFM) and assembly process optimization. The deal marks the largest software deployment in Valor's corporate history.
The engineering system selected by Jabil covers the full scope of the assembly engineering solution for an integrated, efficient and productive CAD to DFM to assembly process.
Chris Singleton, global director for manufacturing engineering at Jabil said, "We will be able to accommodate customer ECN's easier and faster as well as provide a higher level of DFM service for customers. Jabil expects Trilogy tools to reduce the engineering process time for new jobs. This is particularly important to our growing high-mix business and will enable us to accelerate new product introductions."
Copyright 2004, UP Media Group. All rights reserved.
Assembleon (Eindhoven, The Netherlands, a designer and manufacturer of surface-mount pick-and-place equipment for the global electronics industry, and Tecnomatix Technologies Ltd. (Herzlia, Israel), a provider of manufacturing process management (MPM), have announced an agreement to offer a replacement to the CIMbridge software tool with eM-Assembly Expert, from Tecnomatix Unicam, for all Assembleon customers.
Under the terms of the agreement, the software tool—a key component of the printed circuit board (PCB) assembly and test solution suite from Tecnomatix Unicam—will replace the platform currently being used by Assembleon customers. Since acquiring the CIMbridge business unit from Genrad in October 2002, Tecnomatix has been committed to a transition plan to upgrade CIMbridge users to a more advanced, integrated programming platform.
Assembleon customers will also benefit from eM-Document Expert, a subset of the software that automates the creation of method sheets and other documentation for electronic assembly operations.
The programming front-end will interface with Assembleon optimizers and line balancers for all Assembleon machines. Expansion of the platform to other MPM solutions is available directly from Tecnomatix.
Copyright 2004, UP Media Group. All rights reserved.
Visiprise Inc. (Atlanta, GA), a provider of manufacturing execution systems for electronics, automotive, aerospace and defense industries, has been selected by Actia Group (Toulouse, France) to provide quality and production management control for its manufacturing plants in Tunis, Tunisia and Colomiers, France. Operating in 13 countries, Actia Group is a manufacturer of vehicle electronics and diagnostics for major automotive and aerospace original equipment manufacturers (OEMs).
Visiprise Manufacturing, the manufacturing execution software, links OEMs and electronics manufacturing services (EMS) suppliers and provides visibility during the manufacturing process, thereby accelerating new products to market and reducing overall manufacturing costs.
"Actia Group chose Visiprise Manufacturing to handle complex control, tracking and traceability requirements during the manufacturing process," said Robert Consoli, vice president of worldwide sales, Visiprise. "As a supplier to major automotive and aerospace OEMs, Visiprise provides Actia Group with the tools needed to control and to gain visibility of critical routing, repair loop and non-conformance information during the manufacturing process."
Visiprise is a provider of software solutions for real-time visibility and control of manufacturing operations for discrete manufacturers. Its flagship solution is a Web-based, collaborative manufacturing execution system (MES) that helps manage and track the entire production process. It is the industry's only independent platform technology for manufacturing execution.
Copyright 2004, UP Media Group. All rights reserved.
DEK (San Jose, CA), a high accuracy mass imaging solutions provider, has taken electroform stencils to the next level by incorporating an exclusive, sophisticated aperture height control method to their production of Eform stencils.
The stencils incorporate provide superior performance and ensure seal contact to the pad, pad paste deposit and a greater percentage volume of paste on pad. The reactive force created by the stencils provides for an even distribution of paste and allows for a more clean release of paste from the aperture. This technology also delivers ultimate control over stencil thickness and uniformity, ensuring paste volume consistency for fine pitch applications. The stencils also improve solder paste release for some of the more challenging lead-free solder paste formulations.
When the stencil process is combined with the new variable aperture height technology (VAHT), it becomes even more powerful.
Richard Tang, DEK global Eform manager, said, "Board co-planarity issues are a prevalent problem. The uneven resist layer causes a poor seal between the board and the stencil, which can result in printing problems. DEK has that problem solved. Our VAHT, an inherent characteristic of DEK's Eform stencils, adjusts for the variances in resist layer heights and provides a uniform seal across the entire board."
DEK's Eform process and inherent VAHT produce stencils that will enable technology for next-generation fine-pitch surface-mount and semiconductor packaging technologies. As the lines between complex surface-mount assembly and semiconductor packaging processes continue to blur, the need for advanced stencil technology becomes even more apparent.
Copyright 2004, UP Media Group. All rights reserved.
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