TOKYO – Toppan Printing has developed a flexible thin-film transistor that reportedly withstands a million bending cycles to a 1mm radius of curvature and demonstrates advantages for practical application, such as an on/off current ratio of at least 107 with carrier mobility of 10cm2/Vs or more.
IRVINE, CA – TopLine has been granted a US patent for lead-free solder columns for column grid array substrates.
TAIPEI – Pegatron expects to complete expansions in Vietnam and India in the second half of 2021 and begin an expansion at a North American plant this year, say reports.
NEEDHAM, MA – Worldwide shipments of smart home devices reached 801.5 million units in 2020, an increase of 4.5% over 2019, according to International Data Corp. Shipments are forecast to surpass 1.4 billion in 2025, with a five-year CAGR of 12.2%, as consumers seek additional conveniences brought about by home automation products and ambient computing through smart speakers and other products continues to rise.
BANNOCKBURN, IL — North American electronics manufacturing orders in February rose 21.5% year-over-year and 16.7% sequentially.
TURGI, SWITZERLAND – Enics Schweiz is in talks to transfer a majority of its production at its site here to other manufacturing locations, according to reports.