Circuits Assembly Online Magazine - Features

SOUTH NORWALK, CT -- Cable and connector firm Winchester Electronics has been acquired by private equity firm Snow Phipps for an undisclosed sum.

JASPER, IN – Kimball Electronics has acquired the assets of Indianapolis-based contract manufacturer Aircom Manufacturing for an undisclosed sum.

AUSTIN, TX – Fan-out wafer level packaging (FO-WLP) continues to show growth momentum, says TechSearch, with multiple parts found in Samsung’s Galaxy phones and many packages expected in Apple’s next iPhone. Companies are researching large area panel processing as a result of constant pressure to lower cost.

PORTLAND, OR – The 2016 Medical Electronics Symposium will be held Sept. 14-15 at Marylhurst University.

GARBSEN, GERMANY -- A new study from LPKF shows effects of changes in individual process parameters on stencil manufacturing.

SURREY, UK -- High-performance data center or hyper data center networks that require high-performance switches will drive significantly faster speeds, with the vast majority topping 100GbE by 2019, according to new research.