CATANIA, ITALY – Partners in a new publicly-funded research project today announced details of a new 13 million euros program aimed at improving energy-efficiency of new products and technologies.
END – Models, Solutions, Methods and Tools for Energy-Aware Design is a three-year ENIAC (European Nanoelectronics Initiative Advisory Council) project designed to enhance the competitiveness of Europe's semiconductor and electronics equipment companies.
The project will pursue energy efficiency through a holistic approach that unifies, under a common design platform, modeling, simulation, design and EDA techniques for a range of devices and systems (digital blocks, analog/RF blocks, discrete components).
The project will also address the conception and experimentation of new power supplies, with particular emphasis on energy management aspects.
END brings together user companies (IDMs, fabless), design centers, universities and institutes in a range of projects that will establish standards and contribute to building a solid energy-aware electronics design base for Europe.
In particular, project goals include the development of power models for non-bulk CMOS devices, a unified low-power design methodology for heterogeneous systems and SoC (System-on-Chip) devices, energy-efficient building blocks for heterogeneous systems, energy-efficient IP components for SoCs, energy management of systems based on multiple, heterogeneous supplies, and demonstrators of solar energy and wireless sensor systems.
The project will cost approximately 12.6 million euros, with funding provided by both the ENIAC JU (Joint Undertaking) and public authorities of Belgium, Greece, Italy and Slovakia.
Project partners include STMicroelectronics s.r.l., Italy (project coordinator); Centro Ricerche FIAT, Italy; ETH Lab, Eurotech Group, Italy; Numonyx Italy; Consorzio Nazionale Interuniversitario per la Nanoelettronica, Italy; Politecnico di Torino, Italy; Alma Mater Studiorum - Universita di Bologna, Italy; Universita degli Studi di Catania, Italy; Universita degli Studi di Salerno, Italy; NXP Semiconductors, Germany; Intracom S.A. Telecom Solutions, Greece; inAccess Networks, Greece; University of Patras, Greece; ON Semiconductor, Belgium; ON Semiconductor, Slovakia; Slovak University of Technology in Bratislava, Slovakia; Acondicionamiento Tarrasense, Spain, and Centre Suisse d'Electronique et de Microtechnique, Switzerland.
STAMFORD, CT — Worldwide semiconductor capital equipment spending is projected to reach $35.4 billion in 2010, a 113.2% sequential increase according to Gartner.
TAIPEI – Hon Hai Precision Industry (Foxconn) reported May sales rose 78.1% to NT$163.2 billion (US$5.02 billion) on high demand for consumer electronics, handsets and PCs.
TAMPA, FL -- Bulova Technologies continues to search for a buyer for its contract manufacturing unit even in the wake of several new contracts.
FRANKFURT -- The German market for OEM assembly and electronics manufacturing services is expected to grow nearly 15% to 23.6 billion euros this year, a local trade group said.
Press Releases
- Innominds and SIIX launch SIIX-Innominds JV to offer full-stack ODM services in India
- Syrma SGS Technology, Ltd to Accelerate AI-Driven Manufacturing with implementation of analytics and AI solution from Arch Systems in partnership with NMTronics India
- TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
- SMTA “Members of Distinction” Awards Announced