LAKE BUENA VISTA, FL – The Electronic Components and Technology Conference is requesting abstracts on recent, unpublished work for its 61st annual event taking place May 31 - June 3.

Abstracts should represent new developments and knowledge in any of the following: advanced packaging; applied reliability; assembly and manufacturing technology; electronic components and RF; emerging technologies; interconnections; materials and processing; modeling and simulation, or optoelectronics. 

Presentation of papers in a poster format is encouraged.

For more information, contact Wolfgang Sauter at wsauter@us.ibm.com.

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