TORONTO -- Celestica will exercise its option to redeem nearly $340 million in outstanding 7.875% senior subordinated notes due 2011, a move that will save the EMS company $14 million this year in interest expenses.

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BANNOCKBURN, IL – North American PWB shipments in August decreased 26.5% compared to the year prior, while orders dropped 11.7%.
 
Year to date, shipments were down 27%, and orders declined 25.7%. Sequentially, shipments increased 4.5%, and orders rose 13.1%.
 
The book-to-bill ratio held steady at 1.07, says IPC.
 
August rigid PWB shipments dropped 27.4%, and orders were down 13% year-over-year. Year to date, rigid shipments were down 28.7%, while orders fell 26.9%. Sequentially, rigid shipments grew 4.8%, and orders increased 12.2%. The rigid book-to-bill ratio remained above parity at 1.09.
 
Flex shipments dropped 13.7% for the month, while orders rose 7.5% compared to the same month last year. Year to date, flex shipments were down 2.7%, and orders dropped 7.3%. Sequentially, flex shipments increased 2.1%, and orders were up 26.5%.
 
The flex book-to-bill in August fell to 0.92, says the association.
 
“It’s slow going, but we’re seeing more signs of recovery in the North American PCB industry,” said IPC president Denny McGuirk. “Rigid PCB bookings are strengthening, and that is keeping the book-to-bill ratio well above parity. It has been positive now for four consecutive months, which suggests that we should start to see the impact in sales growth this fall.”
 
Rigid PWBs represent an estimated 91% of the current industry in North America, says to IPC. In August, 87% of total shipments reported were domestically produced.
 
Domestic production accounted for 88% of rigid and 82% of flex shipments for the month.

KENOSHA, WI – Promation Inc. has relocated its North American headquarters here: 9522 58th Place, Kenosha, WI, 53144.

The facility includes a larger office space, an expanded equipment showroom area, a process testing/evaluation area, and warehouse facilities.

Promation provides PCB handling equipment, robotic soldering systems, automated label placement, and other custom automation.

SAN JOSE -- Advanced IC packaging technologies such as wafer-level packages, stacked packages and system-in-package have moved into the mainstream of IC production, reports Electronic Trend Publications.

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