BANNOCKBURN, IL – An IPC survey due today on IPC-J-STD-709 revolves around the debate over whether the proposed standard's requirements will be based on a verifiable series of tests.
SAN JOSE – North America-based manufacturers of semiconductor equipment posted $599 million in orders in August and the book-to-bill remained above the key 1.0 level indicating future growth.
HERNDON, VA – The International Electronics Manufacturing Initiative is planning a two-day workshop to identify gaps and challenges related to organic substrate technology. The event will take place Nov. 17 and 18 in Nagoya, Japan.
The meeting will bring together OEMs, packaging firms and substrate providers to discuss technology requirements that must be addressed to facilitate continued miniaturization of electronics packaging.
The goal is to prevent organic substrate technology from becoming a limiting factor in the continued growth of electronics, iNEMI says.
Speakers will discuss packaging-related topics, such as next-generation product sector needs, assembly challenges, and emerging packaging formats. Working teams then will address key topics identified, and formulate potential industry action plans.
The agenda includes confirmed speakers from Amkor, ASE, Cisco, EIT, Ibiden, iNEMI, Intel, Kyocera, Nan Ya, Qualcomm, STATS ChipPAC, Texas Instruments and UMTC.
For more information, visit http://www.inemi.org/cms/calendar/Packaging_Substrates_Nov09.html.
LONDON – An upcoming Frost & Sullivan briefing will focus on the Ukrainian electronics manufacturing market, the research firm announced.
MANCHESTER, NH – EMS provider EPE Corp. has been selected by Business NH Magazine as one of its 100 Top Private Companies, based on average sales growth.
EPE’s three-year revenue growth rate was 21.44%, making it the 14th fastest growing private company in New Hampshire.
According to the list, EPE is also the fastest growing privately held contract assembly in the state.
Business NH Magazine surveys thousands of companies annually to compile the list.
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