Pro Series automated fluid dispensing system integrates vision and laser height sensing with closed-loop encoding to provide a complete automated solution that is quick to set up, easy to program and operate. Smart vision CCD camera captures detailed component part images and converts them into high resolution digital files. PRO4L Series includes fully integrated laser height sensing that detects height variations on the surface of a product and makes corrections to dispensing height to prevent uneven deposits and tip or workpiece damage. Novel DispenseMotion software simplifies setup and facilitates programming with an onscreen preview of dispensing path. Dispense tip can be driven to precise point needed. Eases importing and converting of DXF, CAD, and Excel files. True three-dimensional motion control allows easy programming of dots, lines, circles, arcs, compound arcs, and complex patterns. Comes in platform sizes of 200 x 200, 300 x 300, 400 x 400 and 500 x 500.

Nordson EFD, http://www.nordson.com/en-us/divisions/efd/pages/default.aspx

Supreme 12AOHT-LO one-component thixotropic paste is for bonding and sealing in aerospace, electronics and electro-optic applications. Fully passes ASTM E595 testing for NASA low outgassing and is suited for vacuum environments. Resists thermal cycling and shocks over a service temperature range of 4K to +500°F. Thermal conductivity is 9-10 BTU•in/ft²•hr•°F and is a competent electrical insulator. Bonds to metals, composites, glass, rubbers, ceramics and many plastics. High tensile lap shear, compressive and peel strengths exceed 3,500 psi, 22,000 psi and 5-10 pli, respectively. Is dimensionally stable and has low shrinkage upon cure. Is resistant to a variety of chemicals, particularly to water, oil, fuels and solvents. Requires no mixing. Said to have an unlimited working life at room temperature and cures rapidly at elevated temperatures. Comes in syringes, ½ pints, pints, quarts, gallons and 5 gallon containers.

Master Bond, 

Phoenix Datos|x 2.3  CT software comes with new highlights like a specific production mode for fully automated CT data acquisition, reconstruction and evaluation and supports high precision 3D measurements following VDI 2630 guidelines. New one-button-CT production mode automates entire CT process chain from scan to final evaluation report, speeding 3D metrology and failure analysis. Control functions such as detector calibration or tube conditioning run totally independent from operator influence in the background. Includes system performance monitoring procedures which follow ASTM 1695 guidelines. Minimizing operator time and influence and improving part throughput and evaluation result repeatability, helps raise productivity in industrial production. New metrology package option offers precise, reproducible 3D metrology for nominal/actual CAD comparison, wall thickness analysis and efficient tool correction tasks. 

GE Measurement & Control, ge-mcs.com/en/radiography-x-ray/ct-computed-tomography.html

Inspect-X 4.1 acquisition and analysis software for x-ray and CT systems provides improved real-time imaging and advanced BGA analysis. Real-time image enhancements provide easy-to-interpret images for fast online defect recognition. Image processing algorithms enable automated BGA analysis and reporting for stacked components and multilayer boards. Intelligently adapts to changing x-ray conditions and sample positions, automatically adjusting image controls, contrast and brightness to provide clear, sharp images to aid in defect recognition. Enhancements and filters can be chosen and stored as user profiles to suit different sample types or individual operator preferences. New BGA tool provides powerful image processing, fully automated analysis and detailed reporting to inspect complex packages such as package-on-package (PoP) or dual-layered boards. Features a user-friendly template creation GUI of each BGA package, detailing array dimensions, positions and geometries using a wizard or directly imported from file. Automatically inspects each ball using advanced void analysis featuring single and total void percentage per ball. Also checks ball count, circularity, under- or oversizing, bridging and misalignment defects. Built-in reporting features overlay the x-ray images with color-coded analysis for easy interpretation. Is for large batch inspection; can inspect multiple boards in one routine.

Nikon Metrology, www.nikonmetrology.com