Shenmao's PF606-P lead-free solder paste is designed specifically for the reverse hybrid assembly process, which uses SAC solder paste and BGA components with LTS balls.
Vishay Intertechnology's TS7 single-turn, surface-mount cermet trimmers are designed to work in harsh environments.
Scienscope's Xspection 3120 offline x-ray inspection system is specifically designed for long PCBs.
ULT's ACD 400.1 Ex was developed for the extraction and filtration of dry, flammable and non-flammable gases and vapors in concentrations up to 20% of the lower explosion limit.
Rohm Semiconductor's surface-mount SiC Schottky barrier diodes (SBDs) improve insulation resistance by increasing the creepage distance between terminals.
Specialty Coating Systems PrecisionCure UVC microwave UV curing system now comes in two sizes — 46" and 80".
Press Releases
- NEOTech Significantly Improves Wire Bond Pull Test Process
- Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
- SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
- KYZEN to Spotlight KYZEN E5631, AQUANOX A4618 and Process Control at SMTA Silicon Valley Expo and Tech Forum