Featuring a fully shielded structure, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing EMI. The 0.35mm-pitch connector combines power and signal contacts in a compact 0.6mm stacking-height design, providing four 2.5A power contacts and a fully armored housing for high-reliability, space-constrained applications such as smartphones, tablets, wearables and notebook PCs.

Available with new high-power (-HP) and ultra-high-power (-UP) options, the RMCA Series automotive grade thick-film chip resistors provide greater power density without increasing component footprint. Designed for automotive, industrial, transportation and power management applications, the AEC-qualified resistors deliver stable performance, long service life and improved thermal capability for current sensing, voltage division, biasing and circuit protection in space-constrained designs.

Combining 90W laser power with LPKF's Tensor Technology, the CuttingMaster 3290 laser depaneling system processes FR-4 substrates 2.4 mm thick and greater, along with ceramic, flex and rigid-flex materials, while delivering more than twice the throughput of conventional laser depaneling systems. The system provides clean cuts without carbonization or heat-affected zones, accommodates components up to 40 mm tall on both sides of the board, and features an extended laser service life to reduce maintenance and operating costs.

Designed for placement of the Hirose DF40C-80DP-0.4V female socket, the Custom Universal IL7 Nozzle (Part No. 2026-5682) features a 0.70 x 4.0 mm blade for secure handling during pick-and-place operations. Manufactured to customer specifications, the nozzle supports precise placement of fine-pitch components in high-density SMT assemblies and is compatible with Universal pick-and-place systems.