Parmi USA's Xceed II AOI system features an enhanced platform designed to improve inspection speed and quality.
Apollo Seiko's EF 3040A selective soldering machine combines features such as live teaching, Gerber data teaching, and a 6.5kg solder pot capacity for ultimate flexibility.
Saki's 3Si/3Di-EX Series of 3-D SPI and AOI systems introduce a modular hardware design that allows seamless optical unit upgrades.
Nordson Electronics Solutions' Asymtek Select Coat SL-1040 ultrasonic cleaning station is designed to keep nozzles and needles clean and prevent clogging in conformal coating systems.
ECD’s M-VP rugged vapor phase reflow soldering barrier is designed for use with any ECD six-channel MOLE thermal profiler.
Hirose's DF53 Series connector is its newest addition to its SignalBee connector platform.
Press Releases
- Jack Doetzer, MBA, Appointed President of Circuit Technology Inc., Continuing Family Legacy; Jack Doetzer Comments
- NOTE Expands Collaboration with Waystream Group; Fredrik Lundberg Comments
- Q Source Strengthens Partnership with PACE Worldwide, Showcasing Advanced Soldering and Rework Solutions
- Kimball Electronics Releases 2024 Annual Sustainability Report; Richard Phillips Comments