Summit LT150 is for rework of large, high-density electronic assemblies and next-generation components. Supports components up to 150mm. Large field-of-view vision system with full-component visibility. Scaled top and bottom heating with dual PID control. Supports board sizes up to 24×36in, with optional larger formats. Increased clearance for tall connectors, heat sinks, and power modules. Designed to maintain uniform thermal performance while reducing thermal stress.
Photonics Systems InnoLas DP10X0 laser depaneling system is specifically designed for PCB assembly operations.
Flip Chips with Daisy Chain dummy components are for developing electrical test expertise.
Master Bond’s Supreme 10HTLV is a one-part, heat-cured epoxy. The non-frozen system features a moderately high viscosity with good flow characteristics and does not thicken over time. Supreme 10HTLV offers unlimited working life at room temperature and requires no mixing. The epoxy delivers high mechanical strength, achieving tensile shear strengths exceeding 3,600psi and T-peel strengths up to 30pli. The system withstands cryogenic temperatures down to 4K and remains serviceable up to 400°F. Survives 1,000 hours at 85°C/85% relative humidity. The epoxy also resists water, oils and a wide range of chemicals. Supreme 10HTLV is electrically insulative, with a volume resistivity greater than 10¹²ohm-cm at room temperature, and bonds effectively to metals, glass, ceramics and many plastics. It offers flexible heat-curing profiles, including 60–75 minutes at 250°F or 35–40 minutes at 300°F.
Heraeus Electronics’ mAgic® PE360 is a silver sintering material developed for large-area power module attachment applications requiring high thermal and mechanical performance. The material enables uniform bond lines and low voiding. mAgic® PE360 sinters at relatively low pressure and temperature. The material is available in both printing (PE360P) and dispensing (PE361D) formats.