Mycronic BA 01 small dot ejector for MY700 jet printer accommodates solder paste deposits from 180 to 330µm in diameter with a volume ranging from 1 to 4nl.
Mirtec TAL 3D Scan inspection module attaches to MV-6 Omni 3-D AOI, performing pre-inspection while main 3-D AOI operates.
ASYS VEGO GenS handler has modular design and up to 20% faster cycle time than previous models.
Cencorp 1500 OF EVO 2 odd-form placement machine features large feeder bench capable of handling up to 24 different components in all sizes.
Juki RS-2 placement machine offers high-speed placement up to 50,000cph, aided by laser sensor closer to the board and reduces travel time from pick-up to placement.
Press Releases
- 11th Class of Engineering Interns Begins Forging Success at Hyrel
- Rocka Solutions Announces 2026 Rockin’ Roundtable: An Interactive Discussion on What Really Drives SMT Printing Performance
- SEHO Visits CERN: Working Together for Fundamental Research
- ViTrox Appoints Juan Alfaro as Mexico Sales and Support Manager