Mycronic MYPro A41DX and A41SX placement machines handle boards up to 1,000mm x 609mm in size, 12.5mm thick and up to 10kg using new T1000 conveyor.
Mycronic BA 01 small dot ejector for MY700 jet printer accommodates solder paste deposits from 180 to 330µm in diameter with a volume ranging from 1 to 4nl.
Mirtec TAL 3D Scan inspection module attaches to MV-6 Omni 3-D AOI, performing pre-inspection while main 3-D AOI operates.
ASYS VEGO GenS handler has modular design and up to 20% faster cycle time than previous models.
Cencorp 1500 OF EVO 2 odd-form placement machine features large feeder bench capable of handling up to 24 different components in all sizes.
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