Indium's PicoShot NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.
Aven’s new diagonal cutters are crafted to provide superior cutting capabilities and longevity, making them ideal for a wide range of industrial tasks.
Master Bond's UV15DC80-1Med is a one-component, no-mix epoxy that offers a dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization.
TopLine's new braided solder columns are designed to serve as a drop-in replacement for solder spheres used in BGA components.
Indium's Durafuse HR solder paste alloy is said to deliver enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications.
Stackpole’s RNWA is a thin film chip resistor with all the benefits of wide terminations and is capable of tolerances to 0.1% and TCR as low as 25ppm.
Press Releases
- NEOTech Significantly Improves Wire Bond Pull Test Process
- Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
- SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
- KYZEN to Spotlight KYZEN E5631, AQUANOX A4618 and Process Control at SMTA Silicon Valley Expo and Tech Forum