BEST StencilQuik is a custom stencil designed for ball grid array (BGA) and chipscale package (CSP) placement.

Made from polyimide film with high-temperature, residue-free adhesive, is said to ensure secure alignment and integrate seamlessly into PCB assemblies. Addresses solder mask damage, permitting direct placement over affected areas without additional repairs. Tested to IPC-7711 standard. Meets surface insulation resistance (SIR) requirements.

BEST Inc.

https://www.solder.net

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