Hirose's 1.0mm coaxial connector designed for high-frequency applications up to 110GHz. The connector complies with IEEE Std 287 and is engineered to support advanced RF and microwave designs. Features a compression-mount center contact that accommodates a range of PCB thicknesses, from under 1mm to several millimeters. With voltage standing wave ratio (VSWR) values of 1.8 maximum from 0–67GHz and 1.9 maximum from 67–110GHz. These characteristics support applications where signal integrity and low insertion loss are critical.
ASMPT Siplace V placement platform has a new machine frame and efficient linear drives and measuring systems with increased resolution.
Mycronic MYPro A41DX and A41SX placement machines handle boards up to 1,000mm x 609mm in size, 12.5mm thick and up to 10kg using new T1000 conveyor.
Mycronic BA 01 small dot ejector for MY700 jet printer accommodates solder paste deposits from 180 to 330µm in diameter with a volume ranging from 1 to 4nl.
Mirtec TAL 3D Scan inspection module attaches to MV-6 Omni 3-D AOI, performing pre-inspection while main 3-D AOI operates.
Press Releases
- Tagarno Sees Strong US Sales Growth in 2025, Driven by T50 and Software Demand
- Kimball Electronics Sets Date for Ribbon-Cutting at New Indianapolis Medical Manufacturing Facility
- Nordson’s SELECT Synchro Selective Soldering System Helps Kamstrup Advance Automation, Increase Output 20%, and Reclaim 6 Meters of Factory Floor Space
- Pinnacle Technology Group, Now PTG Electronics, Launches New Brand Identity, Strengthening Its Commitment to Innovation and Progress