CuttingMaster 3290 laser depaneling system processes FR-4 substrates 2.4mm thick and greater, along with ceramic, flex and rigid-flex materials, while delivering more than twice the throughput of conventional laser depaneling systems.

The system provides clean cuts without carbonization or heat-affected zones, accommodates components up to 40 mm tall on both sides of the board, and features an extended laser service life to reduce maintenance and operating costs.

LPKF

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