iDcode is designed to complement the multiple panel barcode reading process by introducing an X-Y stage mounted barcode reader. Permits the reading of multiple barcodes, regardless of whether they are on the topside, bottom-side or a combination of sides.
Machine Vision Products, www.visionpro.com
iDcode is designed to complement the multiple panel barcode reading process by introducing an X-Y stage mounted barcode reader. Permits the reading of multiple barcodes, regardless of whether they are on the topside, bottom-side or a combination of sides.
Machine Vision Products, www.visionpro.com
Ultra SPI solder paste inspection system is based on 64-bit technology. Dual 3D cameras inspect paste deposits on printed circuit boards for multiple defect scenarios. Uses latest Gerber and CAD generation utilities. Can produce a 3D inspection database within of 5 to 10 min. Graphical data output is available. Is 2D/3D capable.
Machine Vision Products, www.visionpro.com
Ultra SPI solder paste inspection system is based on 64-bit technology. Dual 3D cameras inspect paste deposits on printed circuit boards for multiple defect scenarios. Uses latest Gerber and CAD generation utilities. Can produce a 3D inspection database within of 5 to 10 min. Graphical data output is available. Is 2D/3D capable.
Machine Vision Products, www.visionpro.com
Ultra V is for high-volume manufacturing. Is a 64-bit based AOI with 16 cores of processing power, an 8MP high frame rate camera, and a larger field of view, with a core technology of 10µm pixel size. Is capable of inspecting at solder joint level defects on components as small as 01005. Supports sub-pixel algorithms in metrology applications. Is configured with a 508mm x 508mm inspection and board handling area. Ultra V XL permits expansion of inspection envelope to 508mm x 762mm.
Machine Vision Products, www.visionpro.com
Ultra V is for high-volume manufacturing. Is a 64-bit based AOI with 16 cores of processing power, an 8MP high frame rate camera, and a larger field of view, with a core technology of 10µm pixel size. Is capable of inspecting at solder joint level defects on components as small as 01005. Supports sub-pixel algorithms in metrology applications. Is configured with a 508mm x 508mm inspection and board handling area. Ultra V XL permits expansion of inspection envelope to 508mm x 762mm.
Machine Vision Products, www.visionpro.com
Press Releases
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.