Ablestik C100 series conductive die attach films come in 30 and 15 µm thicknesses. Can process thinner die and facilitate greater bondline control. Die sizes range from 1 x 1mm up to 6 x 6mm for a variety of package types, including QFNs and QFPs. Reportedly show excellent wetting ability and low bonding temperature; robust adhesion against moisture and MSL Level 2 performance on all leadframe surface finishes.

Henkel, www.henkel.com/electronics

MC-392LED is for populating extra-long LED panel assemblies in a single pass. Optional CT-150 conveyor extension unit enables two-stage assembly of LED boards of up to 1.2m (47.25”) long. Dual-head placement rate is 6,400 cph. Features ball screw X-Y drive and closed-loop servo control with linear encoding for placement accuracy of 30 µm @3 Sigma. Cognex-based “on-the-fly” vision system views packages from 01005 to 16 x 14mm, including CSPs and µBGAs. Optional upward-looking vision cameras align components up to 150 x 100mm, including large BGAs and QFPs to 0.3.mm (0.012”) lead pitch. Vision inspection camera selectively checks solder paste printing and component placement accuracy. Has 192 tape feeder capacity.

Manncorp, www.manncorp.com/pick-and-place/mc392led

Mydata replacement inline filters increase vacuum and air performance in equipment; last longer than OEM versions. Are capable of capturing particles as small as 0.1 µm. Include K-012-0015 (includes housing, o-ring, mesh filter and two couplers) and K-012-0016 (pack of 12 filters with enhanced air performance and durability). 

Count on Tools, www.cotinc.com

S3088 flex inspects printed circuit board assemblies. Is an enhanced version of S3088-III AOI. Combines high-reliability inspection capability with ease-of-programming features. Is for prototype capability to high-production speed. Intel core i7 computer and touch-screen monitor are included. Has optional operation of vVision inspection software. 100% inspection compatibility.

Viscom, www.viscom.com