Indium3.1 water-soluble Pb-free solder paste is formulated for fine-pitch applications. The company claims the long stencil life virtually eliminates solder paste waste.
Said to exhibit excellent wetting under both air and nitrogen reflow atmosphere. Residue is easily cleaned with water.
Features a wide reflow window, slump resistance, low voiding and low foaming.
MX-Series SMT assembly systems are for medium- to high-volume operations. They feature real time vacuum monitoring prompts the operator (without stopping the machine), when a job is loaded and when running. When it detects the vacuum threshold in the heads is low, it also alerts the operator. Each feeder, in addition to storing part number, lot code and feeder pitch, carries its presentation performance forever.
The series consists of two systems, MX-310 and MX-240. Features include:
- Placement accuracy of 33 µm at 4-sigma accuracy for QFPs, BGAs and CSPs.
- A line scan camera inspects large parts and odd-form.
- A coplanarity checker inspects parts for pre-placement lead warpage.
- Improved illumination on all systems allows for more LEDs (both collimated and oblique), resulting in improved recognition of the full component range.
- Light settings invoked for each part, preventing machine stoppages from "false failures" due to non-uniform lighting.
- A flip-chip camera, for processing FC devices.
Also, the MX-310 has a four stage transport system that enables 25% more speed when processing 8" x 12" boards; a head mounted servo driver/motion controller that permits machines to run at higher speeds through faster response times and eliminates 75% of the cabling from the head to the bottom chassis.
The MX-240 has a closed-loop force control head to minimize impact force. These spindle-mounted sensors operate in concert with high-response vacuum control for force control; a high-speed tray presentation, a side-mounted P40TSU (40-tray shuttle unit) that presents tray fed components without limiting feeder space or board size; and can be configured with two units, which allows 170 unique part numbers to be held per machine.
Tyco Electronics will premiere the Mirae MX-Series at Assembly Technology Expo, Sept. 26-30, 2004.
http://automation.tycoelectronics.com
3M Wafer Support System for ultra-thin semiconductor wafer backgrinding is an alternative to conventional tape processes and is capable of producing wafers as thin as 20 microns. Permits manufacturers to use existing grinding equipment to produce thinner wafers, at faster grinding speeds, with increased yields. Includes both equipment and consumables for a comprehensive approach to wafer backgrinding support challenges.
Features include:
- A wafer mounter to attach the wafer to the glass plate with liquid adhesive.
- A wafer demounter to separate the glass and adhesive from the wafer after the backgrinding process.
- A glass cleaner/coater.
Consumable materials include 3M ultra-clean UV curable spin-on adhesive and a light-to-heat conversion coating. The LTHC layer enables separation of the adhesive from the glass after the backgrinding process.
Unlike tapes used in other systems, the liquid adhesive used in the 3M system flows into the topography of the wafer, providing even support over the entire surface and providing a rigid, uniform base. The system minimizes stress put on the wafer, resulting in less cracking and increased yields.
KIC announces new software for its SlimKIC 2000 oven.
Features include:
- Temperature vs. time feature, for profiling a variety of processes. Allows running of profiles and and experiments for practically any thermal process (batch processes for cure, environmental temperature cycling, rework, high-temperature processes and more).
- Measures temperatures from -150º to 1,050ºF.
- Permits use of SlimKIC 2000 over a broader range of applications.
- User-defined process window; software calculates PWI .
The software is free of charge on the machine.
KIC provides thermal process development and control software.
www.kicthermal.com
Bliss chip tube carts are ergonomically designed for convenient chip tube storage and easy positioning. Constructed of steel, the carts incorporate four bin rows that can be subdivided on ½" centers. Using available slide-in dividers, the rows can be configured into various sizes. The presentation angle of the storage bins can be adjusted for operator comfort and for ease of access during manual component assembly. Gas lift springs assist in raising and lowering the unit.
Standard features of the carts include:
- Built-in ESD protection.
- Adjustable bin size.
- Ergonomically correct.
- Easily adjustable height via gas springs.
- Easily adjustable tilt.
XiDAT XD7500 PCBA x-ray inspection system provides for oblique angle views of up to 70° for any position 360° around the 18 x 16" (458 x 407 mm) inspection area. Inspects BGA and CSP devices. Viewing is enhanced with a filament-free, sub-micron x-ray tube that provides feature recognition to 950 nanometers.
Incorporates the latest revision of Dage's ‘point and click' x-ray operating system.
The machine will be exhibited at Booth 5811 during Assembly Technology Expo, Sept. 28-30.
