PF606-EP305 joint enhanced solder paste (JEP) and solder joint encapsulation material (SJEM) flux SMEF-Z52 are epoxy-based solder materials for very fine pad size (70μm) soldering, especially for advanced display packaging and assembly.
T4AB58-HF360 and T4AB58-HF360D solder pastes are for low-temp. reflow soldering processes designed for printing and dispensing applications.
Desktop dispensing robot integrates different dispensing technologies: from time-pressure to volumetric dispensers to electropneumatic or piezoelectric jet dispensing.
BCcomponents SMDY1 surface-mount AC-line-rated ceramic disc safety capacitors offer Y1 rating of 500VAC and 1500VDC.
SMT 158N is a non-flow, low-temp., slow-cure, high-purity liquid epoxy underfill and capillary underfill encapsulant.
Press Releases
- 2026 IEEE Electronic Components and Technology Conference Student Innovation Challenge Pre-registration Deadline Extended to January 11, 2026
- PCBsync PCB Assembly Introduces Full-Scale Electronic Manufacturing Service
- Magic Leap Partners with Pegatron for AR Glasses Components Production
- TEXMAC/Takaya Appoints ARK Mfg. as New Rep in Arizona