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Editorial
Features
Magazine articles
Tin Whisker Management Guidelines, Part 2
Details
Written by
Joe Smetana and Ron Gedney
Published: 28 December 2005
How 40 µm was found to be the maximum acceptable whisker length for high-rel product, and recommended strategies for mitigation.
Read more ...
White Residues: Are They or Aren't They?
Details
Written by
Terry Munson
Published: 28 December 2005
When it comes to white residues, a defect is not always a defect.
Read more ...
Still the King of Shows
Details
Written by
Mike Buetow
Published: 28 December 2005
Three standout products made royal debuts at the world’s largest electronics equipment fair.
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Using a Printer in Chip Attachment and Encapsulation
Details
Written by
Clive Ashmore
Published: 28 December 2005
Part two of a look at how traditional SMT processes address semiconductor packaging.
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Choosing a BGA Inspection System
Details
Written by
American Competitiveness Institute
Published: 28 December 2005
A review of three types of nondestructive equipment: 2-D x-ray, endoscopic and 3-D x-ray.
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Compensating for Pb-Free Inspection
Details
Written by
Jens Kokott
Published: 28 December 2005
Leaded solder joints offer perfect conditions to reflect AOI light beams. How to adjust for Pb-free parts.
Read more ...
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