Overprinting the pad aids the assembly process, and could balance wetting forces during reflow.
The 300 and 400 series meet the range of needs for selective soldering of components following reflow.
Using FEM, cracking is correlated with average inelastic strain and strain energy density
Press Releases
- VJ Electronix Expands U.S. Coverage with MaRC Technologies Representation in the Pacific Northwest
- Absolute EMS Adopts Luminovo to Modernize and Streamline Quoting
- Iiris Heiskanen Appointed as New CFO of Scanfil
- CE3S Expands Electrostatic Measurement Offering with Next-Generation Compact Static Field Meter from Desco Industries