Intermetallic growth and micro-voiding are issues for boards used in high-temp applications.
The pending J-STD-020D has updated guidelines for handling Pb-free parts, and no more “Tp.”
Press Releases
- AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum
- STI Electronics, Inc. Achieves ISO 13485:2016 Certification, Demonstrating Commitment to Quality in Medical Device Manufacturing
- Indium Corporation to Showcase Solder Products, New Flux-Cored Wire Formula at SMTA International
- Saki Strengthens Presence in India