Intermetallic growth and micro-voiding are issues for boards used in high-temp applications.
The pending J-STD-020D has updated guidelines for handling Pb-free parts, and no more “Tp.”
Press Releases
- ViTrox Americas Expands and Upgrades Its ViTrox Demo Center (VDC); Sy Creed Comments
- SisTech Manufacturing Selects Europlacer to Power High-Mix, High-Reliability Growth
- Q Source Announces New Partnership with C2V to Expand Safety Solutions Offering
- Altus Helps FermionX Enhance Production with Advanced Inspection Solutions; Joe Booth and Will Patrick Comment