Intermetallic growth and micro-voiding are issues for boards used in high-temp applications.
The pending J-STD-020D has updated guidelines for handling Pb-free parts, and no more “Tp.”
Press Releases
- Naprotek Announces Freddie Chavez as VP of Business Development
- Exhibitor Registration and Speaker Applications Now Open for NEDME 2025
- Indium Corporation Experts to Present on Solder and Thermal Solutions at Apex 2025
- Transition Automation to Showcase Expanding Line of Permalex Squeegee Products at IPC Apex