Detecting marginal joints and other solder-related defects on high-temperature thermal pads.
Is the slew of new materials, coatings and processes truly unique, or just the same old hype?
A new, broad industry consortium drives for standardization across design, fabrication, assembly and test.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association