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Written by Mike Buetow
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A first-of-its-kind panel of pick-and-place OEMs offers their take on flip chips, on-board inspection and the future.
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Written by Simon Ilustre
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Component assembly is ripe for defects. Here’s how to avoid them.
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Written by Clive Ashmore
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How squeegee technology breaks the traditional 0.66 mark.
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Written by Dale Cigoy
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Chip caps are prone to leakage, so consider these test methods for minimizing electrical failures.
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