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A first-of-its-kind panel of pick-and-place OEMs offers their take on flip chips, on-board inspection and the future.

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Component assembly is ripe for defects. Here’s how to avoid them.

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How squeegee technology breaks the traditional 0.66 mark.

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Chip caps are prone to leakage, so consider these test methods for minimizing electrical failures.

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Why common metrics fail to root out the causes, and actually add cost in the process.

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Rigorous testing found local vapor phase clearly superior to alternative processes. Read more ...

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