New 3-D technologies with robust interconnects and thermal solutions are on the way.

Ed.: This is the fifth of an occasional series by the authors of the 2019 iNEMI Roadmap. This information is excerpted from the roadmap, available from iNEMI (inemi.org/2019-roadmap-overview).

Aerospace and defense (A&D) products face several challenges unique to this particular market segment, including the extreme environments in which they operate, need for security, desire for reworkability, long duration storage requirements and the functional lifetime over which the products are expected to perform and be supported.

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