SiP, MCP and DDR5 support faster speeds and higher power requirements.

Ed.: This is the sixth of an occasional series by the authors of the 2019 iNEMI Roadmap. This information is excerpted from the roadmap, available from iNEMI (inemi.org/2019-roadmap-overview).

New high-end computing system technologies becoming available for such applications as servers, telecom and the cloud must meet bandwidth, power, thermal and environmental challenges. Advanced packaging technologies that can drive integration and increase functionality, at acceptable cost and risk levels, will be key enablers for the sector.

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