New Products
FX-942 dual-sided optical inspection system incorporates 12MP/5-axis inspection technology for top- and bottom-side applications, including solder ball, solder fillet quality, lead and pin, and foreign material inspection.
Alpha OM-550 HRL1 low temperature solder paste reportedly has SAC 305-type mechanical and thermal reliability.
NI-RFmx 2.2 measurement software for PXI RF test systems, when used with second-generation PXI Vector Signal Transceiver (VST), allows testing of 4.5G and 5G RF components such as transceivers and amplifiers using a wide range of carrier aggregation schemes, even as the 5G standard is still being defined.
REL61 lead-free solder alloy offers thermal cycling performance for such applications as LED lighting, in-cabin automotive electronics and high power applications. Reliability and performance characteristics equal to or greater than SAC 305 and other low/no-silver solder alloys. Mitigates tin whisker formation. Improves spread, flow and wetting versus low/no-silver alloys. Comes in bar, wire or paste.
AIM Solder
www.aimsolder.com/products/high-reliability-alloys
XPRS multi-level direct flow inline test handler for assembled PCBs can be tailored based on each product and production process.
Press Releases
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager
- SP Manufacturing Holds Milestone Anniversary Celebration