New Products
PF735-P267J low melting point lead-free solder paste is designed for jetting. Offers excellent workability and solderability for automatic high-speed jetting production.
V9 low-voiding, no-clean solder paste is formulated to reduce voiding to as low as 1% on BGA and <5% on BTC components, while exhibiting stable print performance on fine-feature devices over 12 hr.
Alpha HRL3 solder sphere is a lead-free, high-reliability, low-temp. alloy for ball-mount applications.
Advanced tilt and rotate dispensing system is available for Camalot Prodigy. Reduces wet-out areas and improves capillary flow for underfill.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association